W. P. Dow, K. Kondo, M. Hayase, U. Cvelbar, F. Roozeboom

Research output: Contribution to journalEditorialAcademicpeer-review

Original languageEnglish
Number of pages1
JournalECS Transactions
Issue number5
Publication statusPublished - 1 Jan 2019
EventInternational Symposium on Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2 - 236th ECS Meeting - Atlanta, United States
Duration: 13 Oct 201917 Oct 2019

Cite this