Prediction of thermo-mechanical integrity of wafer backend processes

V. Gonda, J.M.J. Toonder, den, J.G.J. Beijer, G.Q. Zhang, R.J.O.M. Hoofman, L.J. Ernst

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Abstract

More than 65% of IC failures are related to thermal and mechanical problems. For wafer backend processes, thermo-mechanical failure is one of the major bottlenecks. The ongoing technological trends like miniaturization, introduction of new materials, and function/product integration will increase the importance of thermomechanical reliability, as confirmed by the ITRS (International Technology Roadmap for Semiconductors [1]). since most of the thermomechnaical problems inititate in the design phase, failure prevention - designing for reliability, is strongly desired. To support wafer backend process development, it is necessary to develop reliable and efficient methodologies (both testing and modeling) to predict the thermal and mechnical behavior of backend processes. This paper presents our research results covering the backend process reliability modeling considering both thermal and mechanical (CMP) loading. The emphasis is particularly on the effect of using Cu/SiLK low-dielectric-constant (low-k) structure instead of the traditional Al/SiO2. SiLK is a particular polymeric low-k material developed by the Dow Chemical Company [2]. Our results shows that Cu/SiLK structures exhibit significantly different reliability characteristics than their aluminum predecessors, and that they are more critical from several design aspects. This not only makes the stress management in the stacks more difficult, but also strongly impacts packaging.
Original languageEnglish
Title of host publicationProceedings of the 4th International Conference on Thermal and Mechanical Simulation and Experiment in Microelectronics and Microsystems
EditorsL.J. Ernst
Place of PublicationFrance, Aix-en-Provence
PublisherInstitute of Electrical and Electronics Engineers
Pages359-363
ISBN (Print)0-7803-7054-6
Publication statusPublished - 2003
Event4th International Conference on Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2003) - Aix-en-Provence, France
Duration: 30 Mar 20032 Apr 2003
Conference number: 4
http://www.eurosime.org/b03.htm

Conference

Conference4th International Conference on Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2003)
Abbreviated titleEuroSimE 2003
CountryFrance
CityAix-en-Provence
Period30/03/032/04/03
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    Gonda, V., Toonder, den, J. M. J., Beijer, J. G. J., Zhang, G. Q., Hoofman, R. J. O. M., & Ernst, L. J. (2003). Prediction of thermo-mechanical integrity of wafer backend processes. In L. J. Ernst (Ed.), Proceedings of the 4th International Conference on Thermal and Mechanical Simulation and Experiment in Microelectronics and Microsystems (pp. 359-363). Institute of Electrical and Electronics Engineers.