Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

G.Q. Zhang, C.J. Liu, W.D. van Driel, R. Silfhout, M. van Gils

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

4 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings of the conference EuroSimE 2003
EditorsL.J. Ernst
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages337-343
ISBN (Print)0-7803-7054-6
Publication statusPublished - 2003
Event4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems - Aix-en-Provence, France
Duration: 30 Mar 20032 Apr 2003

Conference

Conference4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
Country/TerritoryFrance
CityAix-en-Provence
Period30/03/032/04/03

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