Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

G.Q. Zhang; C.J. Liu; W.D. van Driel; R. Silfhout; M. van Gils

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

G.Q. Zhang, C.J. Liu, W.D. van Driel, R. Silfhout, M. van Gils

Mechanics of Materials

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings of the conference EuroSimE 2003
Editors	L.J. Ernst
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	337-343
ISBN (Print)	0-7803-7054-6
Publication status	Published - 2003
Event	4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems - Aix-en-Provence, France Duration: 30 Mar 2003 → 2 Apr 2003

Conference

Conference	4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
Country/Territory	France
City	Aix-en-Provence
Period	30/03/03 → 2/04/03

Cite this

@inproceedings{ab96d1f42e964f709bf888f73aa71fb2,

title = "Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods",

author = "G.Q. Zhang and C.J. Liu and {van Driel}, W.D. and R. Silfhout and {van Gils}, M.",

year = "2003",

language = "English",

isbn = "0-7803-7054-6",

pages = "337--343",

editor = "L.J. Ernst",

booktitle = "Proceedings of the conference EuroSimE 2003",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems ; Conference date: 30-03-2003 Through 02-04-2003",

}

Zhang, GQ, Liu, CJ, van Driel, WD, Silfhout, R & van Gils, M 2003, Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. in LJ Ernst (ed.), Proceedings of the conference EuroSimE 2003. Institute of Electrical and Electronics Engineers, Piscataway, pp. 337-343, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, Aix-en-Provence, France, 30/03/03.

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. / Zhang, G.Q.; Liu, C.J.; van Driel, W.D. et al.
Proceedings of the conference EuroSimE 2003. ed. / L.J. Ernst. Piscataway: Institute of Electrical and Electronics Engineers, 2003. p. 337-343.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

AU - Zhang, G.Q.

AU - Liu, C.J.

AU - van Driel, W.D.

AU - Silfhout, R.

AU - van Gils, M.

PY - 2003

Y1 - 2003

M3 - Conference contribution

SN - 0-7803-7054-6

SP - 337

EP - 343

BT - Proceedings of the conference EuroSimE 2003

A2 - Ernst, L.J.

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

T2 - 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems

Y2 - 30 March 2003 through 2 April 2003

ER -