Prediction of crack growth in IC passivation layers

Y.T. He; G.Q. Zhang; R. Silfhout; W.D. Driel, van; M. Gils, van

Prediction of crack growth in IC passivation layers

Y.T. He
, G.Q. Zhang
, R. Silfhout
, W.D. Driel, van
, M. Gils, van

Mechanics of Materials

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003 /
Editors	L.J. Ernst
Pages	323-328
Publication status	Published - 2003

Cite this

He, Y. T., Zhang, G. Q., Silfhout, R., Driel, van, W. D., & Gils, van, M. (2003). Prediction of crack growth in IC passivation layers. In L. J. Ernst (Ed.), Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003 / (pp. 323-328)

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title = "Prediction of crack growth in IC passivation layers",

author = "Y.T. He and G.Q. Zhang and R. Silfhout and \{Driel, van\}, W.D. and \{Gils, van\}, M.",

year = "2003",

language = "English",

isbn = "0-7803-7054-6",

pages = "323--328",

editor = "L.J. Ernst",

booktitle = "Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003 /",

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He, YT, Zhang, GQ, Silfhout, R, Driel, van, WD & Gils, van, M 2003, Prediction of crack growth in IC passivation layers. in LJ Ernst (ed.), Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003 /. pp. 323-328.

Prediction of crack growth in IC passivation layers. / He, Y.T.; Zhang, G.Q.; Silfhout, R. et al.
Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003 /. ed. / L.J. Ernst. 2003. p. 323-328.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Prediction of crack growth in IC passivation layers

AU - He, Y.T.

AU - Zhang, G.Q.

AU - Silfhout, R.

AU - Driel, van, W.D.

AU - Gils, van, M.

PY - 2003

Y1 - 2003

M3 - Conference contribution

SN - 0-7803-7054-6

SP - 323

EP - 328

BT - Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003 /

A2 - Ernst, L.J.

ER -