Prediction of common-mode currents on cables connected to a multilayer printed circuit board and couplings on the board

F.B.M. Horck, van, A.P.J. Deursen, van

Research output: Book/ReportReportAcademic

128 Downloads (Pure)
Original languageEnglish
Place of PublicationEindhoven
PublisherEindhoven University of Technology
Number of pages54
ISBN (Print)90-6144-305-9
Publication statusPublished - 1997

Publication series

NameEUT report. E, Fac. of Electrical Engineering
Volume97-E-305
ISSN (Print)0929-8533

Cite this

Horck, van, F. B. M., & Deursen, van, A. P. J. (1997). Prediction of common-mode currents on cables connected to a multilayer printed circuit board and couplings on the board. (EUT report. E, Fac. of Electrical Engineering; Vol. 97-E-305). Eindhoven: Eindhoven University of Technology.
Horck, van, F.B.M. ; Deursen, van, A.P.J. / Prediction of common-mode currents on cables connected to a multilayer printed circuit board and couplings on the board. Eindhoven : Eindhoven University of Technology, 1997. 54 p. (EUT report. E, Fac. of Electrical Engineering).
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Horck, van, FBM & Deursen, van, APJ 1997, Prediction of common-mode currents on cables connected to a multilayer printed circuit board and couplings on the board. EUT report. E, Fac. of Electrical Engineering, vol. 97-E-305, Eindhoven University of Technology, Eindhoven.

Prediction of common-mode currents on cables connected to a multilayer printed circuit board and couplings on the board. / Horck, van, F.B.M.; Deursen, van, A.P.J.

Eindhoven : Eindhoven University of Technology, 1997. 54 p. (EUT report. E, Fac. of Electrical Engineering; Vol. 97-E-305).

Research output: Book/ReportReportAcademic

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M3 - Report

SN - 90-6144-305-9

T3 - EUT report. E, Fac. of Electrical Engineering

BT - Prediction of common-mode currents on cables connected to a multilayer printed circuit board and couplings on the board

PB - Eindhoven University of Technology

CY - Eindhoven

ER -

Horck, van FBM, Deursen, van APJ. Prediction of common-mode currents on cables connected to a multilayer printed circuit board and couplings on the board. Eindhoven: Eindhoven University of Technology, 1997. 54 p. (EUT report. E, Fac. of Electrical Engineering).