Position control in lithographic equipment

H. Butler, W. Simons

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

4 Citations (Scopus)
15 Downloads (Pure)

Abstract

In IC manufacturing, lithographic scanners expose a circuit pattern onto a semiconductor wafer by means of an optical system. The stage holding the wafer must have a scanning position accuracy of only a few nanometers to support imaging and overlay requirements. In the past 10 years, stage acceleration, position error and settling time have all improved 5-8 times. Compared to lithographic steppers of 25 years ago, the number of controlled stage axes has grown from 3 (analog) to 50 (high-speed digital).
Original languageEnglish
Title of host publicationProceedings of the ASPE 2013 Spring Topical Meeting MIT Laboratory for Manufacturing and Productivity Annual Summit, 21-23 April 2013, Cambridge, Massachusetts
Place of PublicationRaleigh
PublisherAmerican Society of Precision Engineering (ASPE)
Pages7-12
Publication statusPublished - 2013
EventASPE 2013 Spring Topical Meeting MIT Laboratory for Manufacturing and Productivity Annual Summit -
Duration: 21 Apr 201323 Apr 2013

Conference

ConferenceASPE 2013 Spring Topical Meeting MIT Laboratory for Manufacturing and Productivity Annual Summit
Period21/04/1323/04/13

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