Polymer bonding process for nanolithography

T. Borzenko (Corresponding author), M. Tormen, G. Schmidt, L. W. Molenkamp, H. Janssen

    Research output: Contribution to journalArticleAcademicpeer-review

    42 Citations (Scopus)

    Abstract

    We have developed a lithography process which originates from imprint lithography and offers advantages over it. Unlike imprint lithography, not only the sample but also the mold is covered with a thermoplastic polymer. The mold and sample are brought into contact, pressed together and heated above the glass transition temperature of the thermoplast, causing the two polymer layers to become bonded (glued) together. A special treatment of the mold and sample surface causes the polymer film to stick only to the substrate after cooling. The bonding occurs at pressures and temperatures lower than those usually applied in imprint technology, and eliminates problems in conventional imprint technology that are related to lateral transport of the polymer.

    Original languageEnglish
    Pages (from-to)2246-2248
    Number of pages3
    JournalApplied Physics Letters
    Volume79
    Issue number14
    DOIs
    Publication statusPublished - 1 Oct 2001

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    lithography
    polymers
    glass transition temperature
    low pressure
    cooling
    causes

    Cite this

    Borzenko, T., Tormen, M., Schmidt, G., Molenkamp, L. W., & Janssen, H. (2001). Polymer bonding process for nanolithography. Applied Physics Letters, 79(14), 2246-2248. https://doi.org/10.1063/1.1406561
    Borzenko, T. ; Tormen, M. ; Schmidt, G. ; Molenkamp, L. W. ; Janssen, H. / Polymer bonding process for nanolithography. In: Applied Physics Letters. 2001 ; Vol. 79, No. 14. pp. 2246-2248.
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    Borzenko, T, Tormen, M, Schmidt, G, Molenkamp, LW & Janssen, H 2001, 'Polymer bonding process for nanolithography', Applied Physics Letters, vol. 79, no. 14, pp. 2246-2248. https://doi.org/10.1063/1.1406561

    Polymer bonding process for nanolithography. / Borzenko, T. (Corresponding author); Tormen, M.; Schmidt, G.; Molenkamp, L. W.; Janssen, H.

    In: Applied Physics Letters, Vol. 79, No. 14, 01.10.2001, p. 2246-2248.

    Research output: Contribution to journalArticleAcademicpeer-review

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    Borzenko T, Tormen M, Schmidt G, Molenkamp LW, Janssen H. Polymer bonding process for nanolithography. Applied Physics Letters. 2001 Oct 1;79(14):2246-2248. https://doi.org/10.1063/1.1406561