Polymer bonding process for nanolithography

T. Borzenko (Corresponding author), M. Tormen, G. Schmidt, L. W. Molenkamp, H. Janssen

Research output: Contribution to journalArticleAcademicpeer-review

42 Citations (Scopus)

Abstract

We have developed a lithography process which originates from imprint lithography and offers advantages over it. Unlike imprint lithography, not only the sample but also the mold is covered with a thermoplastic polymer. The mold and sample are brought into contact, pressed together and heated above the glass transition temperature of the thermoplast, causing the two polymer layers to become bonded (glued) together. A special treatment of the mold and sample surface causes the polymer film to stick only to the substrate after cooling. The bonding occurs at pressures and temperatures lower than those usually applied in imprint technology, and eliminates problems in conventional imprint technology that are related to lateral transport of the polymer.

Original languageEnglish
Pages (from-to)2246-2248
Number of pages3
JournalApplied Physics Letters
Volume79
Issue number14
DOIs
Publication statusPublished - 1 Oct 2001

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