A novel commercial plasma source for highthroughput processing of crystalline silicon solar cells is presented. In this paper, the plasma properties of this socalled Expanding Thermal Plasma (ETP) technique are addressed in detail and its application in an inline PECVD tool for uftrahigh-rate deposition of silicon nitride for antireflection coating purposes is described.
|Title of host publication||Proceedings of the 31st Conference Record on Photovoltaic Specialists, 3-7 January 2005, Coronado Springs Resort, Lake Buena Vista, FL,USA|
|Publication status||Published - 2005|
|Name||Conference Record of the IEEE Photovoltaic Specialists Conference|