Plasma-enhanced atomic layer deposition of tungsten oxide thin films using (tBuN)2(Me2N)2W and O2 plasma

S. Balasubramanyam, A. Sharma, V. Vandalon, H.C.M. Knoops, W.M.M. Kessels, A.A. Bol

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The growth of tungsten oxide (WO3) thin films by atomic layer deposition (ALD) offers numerous merits including atomic-scale thickness control at low deposition temperatures. In this work, we have developed and characterized a new plasma-enhanced ALD process for WO3 thin films using the metalorganic precursor (tBuN)2(Me2N)2W and O2 plasma as co-reactant over a wide temperature range of 100 °C-400 °C. The influence of deposition temperature on the growth behaviour and film properties is investigated in detail. The WO3 ALD process developed in this work yields a relatively high growth per cycle (GPC) which varies from ~0.7 Å at 100 °C to ~0.45 Å at 400 °C, as-determined by in-situ spectroscopic ellipsometry (SE). Rutherford backscattering spectrometry (RBS) measurements revealed a mass density of 5.9 g/cm3 and near stoichiometric film composition (O/W = 2.9). Both RBS and X-ray photoelectron spectroscopy (XPS) measurements confirmed no detectable C as well as N impurity incorporation. Grazing incidence X-ray diffraction (GI-XRD) measurements indicated that the films deposited at 400 °C were polycrystalline in nature.
Original languageEnglish
Article number01B103
Number of pages7
JournalJournal of Vacuum Science and Technology A
Issue number1
Publication statusPublished - 13 Jan 2018


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