Plasma deposition processes

D.C. Schram, M.C.M. Sanden, van de, J.W.A.M. Gielen, R.J. Severens, R.M.J. Paffen

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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Abstract

A review with 29 refs. focused on the deposition of Si films and thin films of amorphous hydrogenated carbon. With plasma deposition, many materials can be deposited, varying from cryst. (e.g. diamond, graphite) to polycryst. and amorphous films. Plasmas offer nearly unlimited choice of materials, a large versatility in conditions and efficient use of monomers and energy. The various approaches used nowadays are discussed together with a crit. evaluation of the various processes occurring in the plasma and in the plasma wall interaction. The various subprocesses (e.g., ionization, fragmentation, adsorption, and desorption) and recirculation are illustrated with examples taken from high d. plasma deposition. Conclusions were drawn on future outlook. [on SciFinder (R)]
Original languageEnglish
Title of host publicationSurface Modification Technologies IX : proceedings of the International Conference on Surface Modification Technologies, 9th, Cleveland, Oct. 29-Nov. 2, 1995
EditorsT.S. Sudarshan, W. Reitz, J.J. Stiglich
Place of PublicationMinerals, Metals and Materials Society
PublisherWarrendale
Pages383-399
ISBN (Print)0-87339-295-7
Publication statusPublished - 1996
Eventconference; Surface Modification Technologies IX : proceedings of the International Conference on Surface Modification Technologies, 9th, Cleveland, Oct. 29-Nov. 2, 1995 -
Duration: 1 Jan 1996 → …

Publication series

NameBook Institute of Metals
Volume637

Conference

Conferenceconference; Surface Modification Technologies IX : proceedings of the International Conference on Surface Modification Technologies, 9th, Cleveland, Oct. 29-Nov. 2, 1995
Period1/01/96 → …
OtherSurface Modification Technologies IX : proceedings of the International Conference on Surface Modification Technologies, 9th, Cleveland, Oct. 29-Nov. 2, 1995

Fingerprint

Plasma deposition
Plasmas
Diamond
Graphite
Beam plasma interactions
Amorphous films
Ionization
Desorption
Carbon
Monomers
Adsorption
Thin films

Cite this

Schram, D. C., Sanden, van de, M. C. M., Gielen, J. W. A. M., Severens, R. J., & Paffen, R. M. J. (1996). Plasma deposition processes. In T. S. Sudarshan, W. Reitz, & J. J. Stiglich (Eds.), Surface Modification Technologies IX : proceedings of the International Conference on Surface Modification Technologies, 9th, Cleveland, Oct. 29-Nov. 2, 1995 (pp. 383-399). (Book Institute of Metals; Vol. 637). Minerals, Metals and Materials Society: Warrendale.
Schram, D.C. ; Sanden, van de, M.C.M. ; Gielen, J.W.A.M. ; Severens, R.J. ; Paffen, R.M.J. / Plasma deposition processes. Surface Modification Technologies IX : proceedings of the International Conference on Surface Modification Technologies, 9th, Cleveland, Oct. 29-Nov. 2, 1995. editor / T.S. Sudarshan ; W. Reitz ; J.J. Stiglich. Minerals, Metals and Materials Society : Warrendale, 1996. pp. 383-399 (Book Institute of Metals).
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abstract = "A review with 29 refs. focused on the deposition of Si films and thin films of amorphous hydrogenated carbon. With plasma deposition, many materials can be deposited, varying from cryst. (e.g. diamond, graphite) to polycryst. and amorphous films. Plasmas offer nearly unlimited choice of materials, a large versatility in conditions and efficient use of monomers and energy. The various approaches used nowadays are discussed together with a crit. evaluation of the various processes occurring in the plasma and in the plasma wall interaction. The various subprocesses (e.g., ionization, fragmentation, adsorption, and desorption) and recirculation are illustrated with examples taken from high d. plasma deposition. Conclusions were drawn on future outlook. [on SciFinder (R)]",
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Schram, DC, Sanden, van de, MCM, Gielen, JWAM, Severens, RJ & Paffen, RMJ 1996, Plasma deposition processes. in TS Sudarshan, W Reitz & JJ Stiglich (eds), Surface Modification Technologies IX : proceedings of the International Conference on Surface Modification Technologies, 9th, Cleveland, Oct. 29-Nov. 2, 1995. Book Institute of Metals, vol. 637, Warrendale, Minerals, Metals and Materials Society, pp. 383-399, conference; Surface Modification Technologies IX : proceedings of the International Conference on Surface Modification Technologies, 9th, Cleveland, Oct. 29-Nov. 2, 1995, 1/01/96.

Plasma deposition processes. / Schram, D.C.; Sanden, van de, M.C.M.; Gielen, J.W.A.M.; Severens, R.J.; Paffen, R.M.J.

Surface Modification Technologies IX : proceedings of the International Conference on Surface Modification Technologies, 9th, Cleveland, Oct. 29-Nov. 2, 1995. ed. / T.S. Sudarshan; W. Reitz; J.J. Stiglich. Minerals, Metals and Materials Society : Warrendale, 1996. p. 383-399 (Book Institute of Metals; Vol. 637).

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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T1 - Plasma deposition processes

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N2 - A review with 29 refs. focused on the deposition of Si films and thin films of amorphous hydrogenated carbon. With plasma deposition, many materials can be deposited, varying from cryst. (e.g. diamond, graphite) to polycryst. and amorphous films. Plasmas offer nearly unlimited choice of materials, a large versatility in conditions and efficient use of monomers and energy. The various approaches used nowadays are discussed together with a crit. evaluation of the various processes occurring in the plasma and in the plasma wall interaction. The various subprocesses (e.g., ionization, fragmentation, adsorption, and desorption) and recirculation are illustrated with examples taken from high d. plasma deposition. Conclusions were drawn on future outlook. [on SciFinder (R)]

AB - A review with 29 refs. focused on the deposition of Si films and thin films of amorphous hydrogenated carbon. With plasma deposition, many materials can be deposited, varying from cryst. (e.g. diamond, graphite) to polycryst. and amorphous films. Plasmas offer nearly unlimited choice of materials, a large versatility in conditions and efficient use of monomers and energy. The various approaches used nowadays are discussed together with a crit. evaluation of the various processes occurring in the plasma and in the plasma wall interaction. The various subprocesses (e.g., ionization, fragmentation, adsorption, and desorption) and recirculation are illustrated with examples taken from high d. plasma deposition. Conclusions were drawn on future outlook. [on SciFinder (R)]

M3 - Conference contribution

SN - 0-87339-295-7

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BT - Surface Modification Technologies IX : proceedings of the International Conference on Surface Modification Technologies, 9th, Cleveland, Oct. 29-Nov. 2, 1995

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Schram DC, Sanden, van de MCM, Gielen JWAM, Severens RJ, Paffen RMJ. Plasma deposition processes. In Sudarshan TS, Reitz W, Stiglich JJ, editors, Surface Modification Technologies IX : proceedings of the International Conference on Surface Modification Technologies, 9th, Cleveland, Oct. 29-Nov. 2, 1995. Minerals, Metals and Materials Society: Warrendale. 1996. p. 383-399. (Book Institute of Metals).