Plasma deposition processes

D.C. Schram, M.C.M. Sanden, van de, J.W.A.M. Gielen, R.J. Severens, R.M.J. Paffen

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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A review with 29 refs. focused on the deposition of Si films and thin films of amorphous hydrogenated carbon. With plasma deposition, many materials can be deposited, varying from cryst. (e.g. diamond, graphite) to polycryst. and amorphous films. Plasmas offer nearly unlimited choice of materials, a large versatility in conditions and efficient use of monomers and energy. The various approaches used nowadays are discussed together with a crit. evaluation of the various processes occurring in the plasma and in the plasma wall interaction. The various subprocesses (e.g., ionization, fragmentation, adsorption, and desorption) and recirculation are illustrated with examples taken from high d. plasma deposition. Conclusions were drawn on future outlook. [on SciFinder (R)]
Original languageEnglish
Title of host publicationSurface Modification Technologies IX : proceedings of the International Conference on Surface Modification Technologies, 9th, Cleveland, Oct. 29-Nov. 2, 1995
EditorsT.S. Sudarshan, W. Reitz, J.J. Stiglich
Place of PublicationMinerals, Metals and Materials Society
ISBN (Print)0-87339-295-7
Publication statusPublished - 1996
Event9th International Conference on Surface Modification Technologies - Cleveland
Duration: 29 Oct 19962 Nov 1996

Publication series

NameBook Institute of Metals


Conference9th International Conference on Surface Modification Technologies


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