Plasma atomic layer deposition

Harm C.M. Knoops (Inventor), Koen de Peuter (Inventor), Wilhelmus M.M. Kessels (Inventor)

Research output: PatentPatent publication

3 Downloads (Pure)

Abstract

Plasma atomic layer deposition (ALD) is optimized through modulation of the gas residence time during an excited species phase, wherein activated reactant is supplied such as from a plasma. Reduced residence time increases the quality of the deposited layer, such as reducing wet etch rates, increasing index of refraction and/or reducing impurities in the layer. For example, dielectric layers, particularly silicon nitride films, formed from such optimized plasma ALD processes have low levels of impurities remaining from the silicon precursor.

Original languageEnglish
Patent numberUS10822700
Priority date2/07/20
Publication statusPublished - 3 Nov 2020

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