Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications

S.B.S. Heil, E. Langereis, F. Roozeboom, A. Kemmeren, N.P. Pham, P.M. Sarro, M.C.M. Sanden, van de, W.M.M. Kessels

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Original languageEnglish
Title of host publicationMaterials, technology and reliability for advanced interconnects - 2005 : symposium held March 28 - April 1 2005, San Francisco, California, U.S.A.
EditorsR. Besser
Place of PublicationWarrendale, Pa
PublisherMaterials Research Society
Pages215-220
ISBN (Print)1-558-99816-0
Publication statusPublished - 2005
EventMaterials, Technology and Reliability for Advanced Interconnects 2005, March 28-April 1, 2005, San Francisco, CA, USA - San Francisco, CA, United States
Duration: 28 Mar 20051 Apr 2005

Publication series

NameMaterials Research Society Symposium Proceedings
Volume863
ISSN (Print)0272-9172

Conference

ConferenceMaterials, Technology and Reliability for Advanced Interconnects 2005, March 28-April 1, 2005, San Francisco, CA, USA
CountryUnited States
CitySan Francisco, CA
Period28/03/051/04/05
OtherSymposium held at the 2005 MRS Spring Meeting

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