Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications

S.B.S. Heil, E. Langereis, F. Roozeboom, A. Kemmeren, N.P. Pham, P.M. Sarro, M.C.M. Sanden, van de, W.M.M. Kessels

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)
Original languageEnglish
Title of host publicationMaterials, technology and reliability for advanced interconnects - 2005 : symposium held March 28 - April 1 2005, San Francisco, California, U.S.A.
EditorsR. Besser
Place of PublicationWarrendale, Pa
PublisherMaterials Research Society
Pages215-220
ISBN (Print)1-558-99816-0
Publication statusPublished - 2005
EventMaterials, Technology and Reliability for Advanced Interconnects 2005, March 28-April 1, 2005, San Francisco, CA, USA - San Francisco, CA, United States
Duration: 28 Mar 20051 Apr 2005

Publication series

NameMaterials Research Society Symposium Proceedings
Volume863
ISSN (Print)0272-9172

Conference

ConferenceMaterials, Technology and Reliability for Advanced Interconnects 2005, March 28-April 1, 2005, San Francisco, CA, USA
CountryUnited States
CitySan Francisco, CA
Period28/03/051/04/05
OtherSymposium held at the 2005 MRS Spring Meeting

Cite this

Heil, S. B. S., Langereis, E., Roozeboom, F., Kemmeren, A., Pham, N. P., Sarro, P. M., ... Kessels, W. M. M. (2005). Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications. In R. Besser (Ed.), Materials, technology and reliability for advanced interconnects - 2005 : symposium held March 28 - April 1 2005, San Francisco, California, U.S.A. (pp. 215-220). (Materials Research Society Symposium Proceedings; Vol. 863). Warrendale, Pa: Materials Research Society.
Heil, S.B.S. ; Langereis, E. ; Roozeboom, F. ; Kemmeren, A. ; Pham, N.P. ; Sarro, P.M. ; Sanden, van de, M.C.M. ; Kessels, W.M.M. / Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications. Materials, technology and reliability for advanced interconnects - 2005 : symposium held March 28 - April 1 2005, San Francisco, California, U.S.A.. editor / R. Besser. Warrendale, Pa : Materials Research Society, 2005. pp. 215-220 (Materials Research Society Symposium Proceedings).
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title = "Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications",
author = "S.B.S. Heil and E. Langereis and F. Roozeboom and A. Kemmeren and N.P. Pham and P.M. Sarro and {Sanden, van de}, M.C.M. and W.M.M. Kessels",
year = "2005",
language = "English",
isbn = "1-558-99816-0",
series = "Materials Research Society Symposium Proceedings",
publisher = "Materials Research Society",
pages = "215--220",
editor = "R. Besser",
booktitle = "Materials, technology and reliability for advanced interconnects - 2005 : symposium held March 28 - April 1 2005, San Francisco, California, U.S.A.",
address = "United States",

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Heil, SBS, Langereis, E, Roozeboom, F, Kemmeren, A, Pham, NP, Sarro, PM, Sanden, van de, MCM & Kessels, WMM 2005, Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications. in R Besser (ed.), Materials, technology and reliability for advanced interconnects - 2005 : symposium held March 28 - April 1 2005, San Francisco, California, U.S.A.. Materials Research Society Symposium Proceedings, vol. 863, Materials Research Society, Warrendale, Pa, pp. 215-220, Materials, Technology and Reliability for Advanced Interconnects 2005, March 28-April 1, 2005, San Francisco, CA, USA, San Francisco, CA, United States, 28/03/05.

Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications. / Heil, S.B.S.; Langereis, E.; Roozeboom, F.; Kemmeren, A.; Pham, N.P.; Sarro, P.M.; Sanden, van de, M.C.M.; Kessels, W.M.M.

Materials, technology and reliability for advanced interconnects - 2005 : symposium held March 28 - April 1 2005, San Francisco, California, U.S.A.. ed. / R. Besser. Warrendale, Pa : Materials Research Society, 2005. p. 215-220 (Materials Research Society Symposium Proceedings; Vol. 863).

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

TY - GEN

T1 - Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications

AU - Heil, S.B.S.

AU - Langereis, E.

AU - Roozeboom, F.

AU - Kemmeren, A.

AU - Pham, N.P.

AU - Sarro, P.M.

AU - Sanden, van de, M.C.M.

AU - Kessels, W.M.M.

PY - 2005

Y1 - 2005

M3 - Conference contribution

SN - 1-558-99816-0

T3 - Materials Research Society Symposium Proceedings

SP - 215

EP - 220

BT - Materials, technology and reliability for advanced interconnects - 2005 : symposium held March 28 - April 1 2005, San Francisco, California, U.S.A.

A2 - Besser, R.

PB - Materials Research Society

CY - Warrendale, Pa

ER -

Heil SBS, Langereis E, Roozeboom F, Kemmeren A, Pham NP, Sarro PM et al. Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications. In Besser R, editor, Materials, technology and reliability for advanced interconnects - 2005 : symposium held March 28 - April 1 2005, San Francisco, California, U.S.A.. Warrendale, Pa: Materials Research Society. 2005. p. 215-220. (Materials Research Society Symposium Proceedings).