Planar sensors for dielectric and magnetic materials measurement: A quantitative sensitivity comparison

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Abstract

Planar transmission lines are frequently used to characterize the RF properties of materials. However, the question arises which geometry should be chosen for optimal measurement sensitivity to the material under test. Thus far, this question appears to go unanswered. In this paper, the suitability of the three most popular planar geometries is compared for material characterization. To this end, the impact of a material under test on the apparent properties (i.e. the equivalent homogeneous cross-sections) is examined. This is done for the complex permittivity and the complex permeability, using conformal mapping methods, full-wave simulations and measurements. It is shown that the coplanar waveguide (without conductor backing) is the most suitable structure of the three, since it is the most sensitive to changes in the properties of the material under test.

Original languageEnglish
Title of host publication12th European Conference on Antennas and Propagation (EuCAP 2018)
PublisherInstitution of Engineering and Technology (IET)
Number of pages4
ISBN (Electronic)978-1-78561-816-1
ISBN (Print)978-1-78561-815-4
DOIs
Publication statusPublished - 10 Dec 2018
Event12th European Conference on Antennas and Propagation, (EuCAP 2018) - London, United Kingdom
Duration: 9 Apr 201813 Apr 2018
Conference number: 12
http://www.eucap2018.org/

Conference

Conference12th European Conference on Antennas and Propagation, (EuCAP 2018)
Abbreviated titleEuCAP 2018
CountryUnited Kingdom
CityLondon
Period9/04/1813/04/18
Internet address

Keywords

  • Coplanar waveguides
  • Coplanar waveguides with ground
  • Material characterization
  • Microstrip lines

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    Bronckers, L. A., van Rossum, M. J. R. A., & Smolders, A. B. (2018). Planar sensors for dielectric and magnetic materials measurement: A quantitative sensitivity comparison. In 12th European Conference on Antennas and Propagation (EuCAP 2018) [8568328] Institution of Engineering and Technology (IET). https://doi.org/10.1049/cp.2018.0650