Pick and place in unstable environments

TNO and Holst Centre are working on two new flexible electronic products, OLED and Smart Blister, which is based on bonding chips (area 1mm2) on printed markers on foils (thickness 1 mm). Due to the main property of foil are unstable and easily deformed, TNO and Holst Centre like to have a new concept which combines pick & place machine with a roll-to-roll process. To improve low accuracy of commercially available pick & place machine, a possible solution is to measure the marker position on the foil directly with a vision system on the production head with respect to the foil. This approach could monitor the behaviour of the foil in real time. This project designed an efficient new marker recognition algorithm for the visual servoing system which can be performed the marker position measurement to control the pick & place robot for bonding the chip faster, better than before. It is very well feasible to realise a closed loop control system with a bandwidth of over 50 Hz based on high speed imaging. More image information is obtained next to the displacement, such as location, scaling, rotation. The total delay time is shortened.