PIC production and wafer test strategy development

Research output: ThesisPd Eng ThesisAcademic

Abstract

Photonics Integrated Circuits (PIC) are devices on which several optical components are integrated. PIC have many applications in telecommunication and all kinds of industrial and medical measurement equipment.
In Photonics fabrication, opto-electronic components are fabricated on wafers. Then wafers are diced and cleaved to chips. In order to achieve successful mass production, many iterations in photonics building block simulation and mask design are required. Therefore, extensive component characterization and wafer quality check are essential.
In this project, the performance of PIC components with different layer stack materials and different designs were studied. Also, an analysis tool was designed to execute wafer analysis and acceptance tests.
LanguageEnglish
Supervisors/Advisors
  • Cottaar, Ward, Supervisor
  • Leijtens, Xaveer, Supervisor
  • Kleijn, E., External supervisor
  • Tahvili, M.S., External supervisor
Award date27 Jun 2019
Place of PublicationEindhoven
Publisher
StatePublished - 27 Jun 2019

Fingerprint

Photonics
Integrated circuits
Acceptance tests
Telecommunication
Masks
Fabrication

Bibliographical note

PDEng thesis. - Confidential for ever.

Cite this

Fereydooni, Y. (2019). PIC production and wafer test strategy development Eindhoven: Technische Universiteit Eindhoven
Fereydooni, Yasaman. / PIC production and wafer test strategy development. Eindhoven : Technische Universiteit Eindhoven, 2019. 33 p.
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title = "PIC production and wafer test strategy development",
abstract = "Photonics Integrated Circuits (PIC) are devices on which several optical components are integrated. PIC have many applications in telecommunication and all kinds of industrial and medical measurement equipment.In Photonics fabrication, opto-electronic components are fabricated on wafers. Then wafers are diced and cleaved to chips. In order to achieve successful mass production, many iterations in photonics building block simulation and mask design are required. Therefore, extensive component characterization and wafer quality check are essential.In this project, the performance of PIC components with different layer stack materials and different designs were studied. Also, an analysis tool was designed to execute wafer analysis and acceptance tests.",
author = "Yasaman Fereydooni",
note = "PDEng thesis. - Confidential for ever.",
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day = "27",
language = "English",
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publisher = "Technische Universiteit Eindhoven",

}

PIC production and wafer test strategy development. / Fereydooni, Yasaman.

Eindhoven : Technische Universiteit Eindhoven, 2019. 33 p.

Research output: ThesisPd Eng ThesisAcademic

TY - THES

T1 - PIC production and wafer test strategy development

AU - Fereydooni,Yasaman

N1 - PDEng thesis. - Confidential for ever.

PY - 2019/6/27

Y1 - 2019/6/27

N2 - Photonics Integrated Circuits (PIC) are devices on which several optical components are integrated. PIC have many applications in telecommunication and all kinds of industrial and medical measurement equipment.In Photonics fabrication, opto-electronic components are fabricated on wafers. Then wafers are diced and cleaved to chips. In order to achieve successful mass production, many iterations in photonics building block simulation and mask design are required. Therefore, extensive component characterization and wafer quality check are essential.In this project, the performance of PIC components with different layer stack materials and different designs were studied. Also, an analysis tool was designed to execute wafer analysis and acceptance tests.

AB - Photonics Integrated Circuits (PIC) are devices on which several optical components are integrated. PIC have many applications in telecommunication and all kinds of industrial and medical measurement equipment.In Photonics fabrication, opto-electronic components are fabricated on wafers. Then wafers are diced and cleaved to chips. In order to achieve successful mass production, many iterations in photonics building block simulation and mask design are required. Therefore, extensive component characterization and wafer quality check are essential.In this project, the performance of PIC components with different layer stack materials and different designs were studied. Also, an analysis tool was designed to execute wafer analysis and acceptance tests.

M3 - Pd Eng Thesis

T3 - PDEng report

PB - Technische Universiteit Eindhoven

CY - Eindhoven

ER -

Fereydooni Y. PIC production and wafer test strategy development. Eindhoven: Technische Universiteit Eindhoven, 2019. 33 p. (PDEng report).