Abstract
The kinetics and mechanism of the title processes are discussed on the basis of a model in which the plasma-surface system is subdivided into 5 regions: (I) plasma prodn., (II) plasma flow plus radicals, (III) gas adsorbed layer, (IV) modified surface, and (V) undisturbed solid (or liq.) state. Emphasis is place on the first 2 regions in relation to the 3rd. The discussion is illustrated with measured plasma data for etching of SiO2 with CF4-Ar plasma mixts. and the deposition of C layers with CH4-Ar-H2 plasmas
Original language | English |
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Title of host publication | SASP 86, symposium on atomic and surface physics : contributions |
Editors | F. Howorka, W. Lindinger, T.D. Maerk |
Place of Publication | Innsbruck |
Publisher | Universität Innsbruck |
Pages | 181-187 |
Publication status | Published - 1986 |