Abstract
Scaling up Photonic Integrated Circuits from prototyping and small batch fabrication to volume production requires revision and improvements of many processes across the full manufacturing chain. These efforts include automation and standardization of electronic-photonic test processes, tools and methods. Recent developments of automated, prepackaging die test services, carried at Photonic Integration Technology Center and TU/e as a part of European pilot lines, PIXAPP and InPulse will be presented.
Original language | English |
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Title of host publication | 2020 22nd International Conference on Transparent Optical Networks, ICTON 2020 |
Publisher | IEEE Computer Society |
Number of pages | 4 |
ISBN (Electronic) | 9781728184234 |
DOIs | |
Publication status | Published - Jul 2020 |
Event | 22nd International Conference on Transparent Optical Networks, ICTON 2020 - Bari, Italy Duration: 19 Jul 2020 → 23 Jul 2020 Conference number: 22 |
Conference
Conference | 22nd International Conference on Transparent Optical Networks, ICTON 2020 |
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Country/Territory | Italy |
City | Bari |
Period | 19/07/20 → 23/07/20 |
Funding
The authors would like to acknowledge European Union's Horizon 2020 programmes n° 731954 – PIXAPP, n° 824980 – InPulse, and the Stimulus OPZuid program through the Open Innovation Photonic ICs project (PROJ-00315) for supporting this work.
Keywords
- Integrated photonics
- Photonic integrated circuits
- Test
- Test automation