Photonic integrated circuits from small batches to volumes: Standardization and automation of test

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Abstract

Scaling up Photonic Integrated Circuits from prototyping and small batch fabrication to volume production requires revision and improvements of many processes across the full manufacturing chain. These efforts include automation and standardization of electronic-photonic test processes, tools and methods. Recent developments of automated, prepackaging die test services, carried at Photonic Integration Technology Center and TU/e as a part of European pilot lines, PIXAPP and InPulse will be presented.

Original languageEnglish
Title of host publication2020 22nd International Conference on Transparent Optical Networks, ICTON 2020
PublisherIEEE Computer Society
Number of pages4
ISBN (Electronic)9781728184234
DOIs
Publication statusPublished - Jul 2020
Event22nd International Conference on Transparent Optical Networks, ICTON 2020 - Bari, Italy
Duration: 19 Jul 202023 Jul 2020
Conference number: 22

Conference

Conference22nd International Conference on Transparent Optical Networks, ICTON 2020
Country/TerritoryItaly
CityBari
Period19/07/2023/07/20

Funding

The authors would like to acknowledge European Union's Horizon 2020 programmes n° 731954 – PIXAPP, n° 824980 – InPulse, and the Stimulus OPZuid program through the Open Innovation Photonic ICs project (PROJ-00315) for supporting this work.

Keywords

  • Integrated photonics
  • Photonic integrated circuits
  • Test
  • Test automation

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