Photonic hybrid assembly through flexible waveguides

K. Wörhoff, A. Prak, F. Postma, A. Leinse, Kai Wu, T. J. Peters, M. Tichem, B. Amaning-Appiah, V. Renukappa, G. Vollrath, J. Balcells-Ventura, P. Uhlig, M. Seyfried, D. Rose, R. Santos, X.J.M. Leijtens, B. Flintham, M. Wale, D. Robbins

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)
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Abstract

Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I/O in InP PICs, even with waveguide spot size conversion. In a European research initiative - PHASTFlex - we develop and investigate an innovative, novel assembly concept, in which the waveguides in a matching TriPleX interposer PIC are released during fabrication to make them movable. After assembly of both chips by flip-chip bonding on a common carrier, TriPleX based actuators and clamping functions position and fix the flexible waveguides with the required accuracy.

Original languageEnglish
Title of host publicationSilicon Photonics and Photonic Integrated Circuits V, 3-7 April 2016, Brussels, Belgium
Place of PublicationBellingham
PublisherSPIE
ISBN (Electronic)9781510601369
DOIs
Publication statusPublished - 2016
EventSilicon Photonics and Photonic Integrated Circuits V - Brussels, Belgium
Duration: 3 Apr 20167 Apr 2016

Publication series

NameProceedings of SPIE
Volume9891

Conference

ConferenceSilicon Photonics and Photonic Integrated Circuits V
CountryBelgium
CityBrussels
Period3/04/167/04/16

Keywords

  • Eutectic bonding
  • Flip-chip
  • InP
  • LTCC
  • MEMS
  • Photonic assembly
  • Photonic integrated circuit
  • TriPleX

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