Abstract
We present a scalable passive alignment method employing suspended SiN-based waveguides to interface a 32-channel fiber array to edge couplers in integrated trenches on InP photonic integrated circuits. The approach demonstrates an alignment tolerance of 2 μm within 0.5 dB excess loss.
Original language | English |
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Title of host publication | 2023 IEEE Photonics Conference, IPC 2023 |
Publisher | Institute of Electrical and Electronics Engineers |
Chapter | WB2.1 |
Number of pages | 2 |
ISBN (Electronic) | 979-8-3503-4722-7 |
DOIs | |
Publication status | Published - 25 Dec 2023 |
Event | 2023 IEEE Photonics Conference, IPC 2023 - Orlando, United States Duration: 12 Nov 2023 → 16 Nov 2023 |
Conference
Conference | 2023 IEEE Photonics Conference, IPC 2023 |
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Country/Territory | United States |
City | Orlando |
Period | 12/11/23 → 16/11/23 |
Funding
This work was supported by Microsoft Research through its Ph.D. Scholarship Programme, and was co-founded by the European Union through the Eurostars FLEXFIX program nr.2018.29.
Funders | Funder number |
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Microsoft Research | |
European Commission |
Keywords
- fiber-to-chip coupling
- passive optical alignment
- Photonic integrated circuit (PIC)