Passive Alignment of Fiber Array to InP Photonic Integrated Circuit using Suspended Waveguides

W. Tian, R. Dekker, J. Van Kerkhof, K. Williams, X. Leijtens

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

2 Citations (Scopus)
8 Downloads (Pure)

Abstract

We present a scalable passive alignment method employing suspended SiN-based waveguides to interface a 32-channel fiber array to edge couplers in integrated trenches on InP photonic integrated circuits. The approach demonstrates an alignment tolerance of 2 μm within 0.5 dB excess loss.

Original languageEnglish
Title of host publication2023 IEEE Photonics Conference, IPC 2023
PublisherInstitute of Electrical and Electronics Engineers
ChapterWB2.1
Number of pages2
ISBN (Electronic)979-8-3503-4722-7
DOIs
Publication statusPublished - 25 Dec 2023
Event2023 IEEE Photonics Conference, IPC 2023 - Orlando, United States
Duration: 12 Nov 202316 Nov 2023

Conference

Conference2023 IEEE Photonics Conference, IPC 2023
Country/TerritoryUnited States
CityOrlando
Period12/11/2316/11/23

Funding

This work was supported by Microsoft Research through its Ph.D. Scholarship Programme, and was co-founded by the European Union through the Eurostars FLEXFIX program nr.2018.29.

FundersFunder number
Microsoft Research
European Commission

    Keywords

    • fiber-to-chip coupling
    • passive optical alignment
    • Photonic integrated circuit (PIC)

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