Packaged hybrid integrated phased-array multi-wavelength laser

D. Thourhout, Van, A. Hove, van, T. Caenegem, van, I. Moerman, P. Van Daele, R.G.F. Baets, X.J.M. Leijtens, M.K. Smit

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10 Citations (Scopus)

Abstract

A hybrid integration technology has been developed which only involves the use of InP components. A six-channel multiwavelength laser has been realised using this approach. The chips were bonded using a UV-curable epoxy and packaged in a commercial laser module. A 1.6 GHz 3 dB bandwidth and a linewidth of
Original languageEnglish
Pages (from-to)434-436
Number of pages3
JournalElectronics Letters
Volume36
Issue number5
DOIs
Publication statusPublished - 2000

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    Thourhout, Van, D., Hove, van, A., Caenegem, van, T., Moerman, I., Van Daele, P., Baets, R. G. F., Leijtens, X. J. M., & Smit, M. K. (2000). Packaged hybrid integrated phased-array multi-wavelength laser. Electronics Letters, 36(5), 434-436. https://doi.org/10.1049/el:20000385