Packaged hybrid integrated phased-array multi-wavelength laser

D. Thourhout, Van; A. Hove, van; T. Caenegem, van; I. Moerman; P. Van Daele; R.G.F. Baets; X.J.M. Leijtens; M.K. Smit

doi:10.1049/el:20000385

Packaged hybrid integrated phased-array multi-wavelength laser

D. Thourhout, Van, A. Hove, van, T. Caenegem, van, I. Moerman, P. Van Daele, R.G.F. Baets, X.J.M. Leijtens, M.K. Smit

Photonic Integration

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Abstract

A hybrid integration technology has been developed which only involves the use of InP components. A six-channel multiwavelength laser has been realised using this approach. The chips were bonded using a UV-curable epoxy and packaged in a commercial laser module. A 1.6 GHz 3 dB bandwidth and a linewidth of

Original language	English
Pages (from-to)	434-436
Number of pages	3
Journal	Electronics Letters
Volume	36
Issue number	5
DOIs	https://doi.org/10.1049/el:20000385
Publication status	Published - 2000

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title = "Packaged hybrid integrated phased-array multi-wavelength laser",

abstract = "A hybrid integration technology has been developed which only involves the use of InP components. A six-channel multiwavelength laser has been realised using this approach. The chips were bonded using a UV-curable epoxy and packaged in a commercial laser module. A 1.6 GHz 3 dB bandwidth and a linewidth of",

author = "{Thourhout, Van}, D. and {Hove, van}, A. and {Caenegem, van}, T. and I. Moerman and {Van Daele}, P. and R.G.F. Baets and X.J.M. Leijtens and M.K. Smit",

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AU - Thourhout, Van, D.

AU - Hove, van, A.

AU - Caenegem, van, T.

AU - Moerman, I.

AU - Van Daele, P.

AU - Baets, R.G.F.

AU - Leijtens, X.J.M.

AU - Smit, M.K.

PY - 2000

Y1 - 2000

N2 - A hybrid integration technology has been developed which only involves the use of InP components. A six-channel multiwavelength laser has been realised using this approach. The chips were bonded using a UV-curable epoxy and packaged in a commercial laser module. A 1.6 GHz 3 dB bandwidth and a linewidth of

AB - A hybrid integration technology has been developed which only involves the use of InP components. A six-channel multiwavelength laser has been realised using this approach. The chips were bonded using a UV-curable epoxy and packaged in a commercial laser module. A 1.6 GHz 3 dB bandwidth and a linewidth of

U2 - 10.1049/el:20000385

DO - 10.1049/el:20000385

M3 - Article

SN - 0013-5194

VL - 36

SP - 434

EP - 436

JO - Electronics Letters

JF - Electronics Letters

IS - 5

ER -

Packaged hybrid integrated phased-array multi-wavelength laser

Abstract

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