Packaged hybrid integrated phased-array multi-wavelength laser

D. Thourhout, Van, A. Hove, van, T. Caenegem, van, I. Moerman, P. Van Daele, R.G.F. Baets, X.J.M. Leijtens, M.K. Smit

Research output: Contribution to journalArticleAcademicpeer-review

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A hybrid integration technology has been developed which only involves the use of InP components. A six-channel multiwavelength laser has been realised using this approach. The chips were bonded using a UV-curable epoxy and packaged in a commercial laser module. A 1.6 GHz 3 dB bandwidth and a linewidth of
Original languageEnglish
Pages (from-to)434-436
Number of pages3
JournalElectronics Letters
Issue number5
Publication statusPublished - 2000


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