Optimisation of photoresist removal from silicon wafers using atmospheric-pressure plasma jet effluent

A.T. West, M. Schans, van der, C. Xu, T. Gans, M. Cooke, E. Wagenaars

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Abstract

Atmospheric-pressure plasma jets (APPJs) can offer high-quality etch of photoresist at rates up to 10 µm/min, compared to 10 - 100 nm/min using traditional low-pressure methods, while avoiding the inconveniences of operating vacuum systems. We determined that the removal rate of photoresist is strongly linked with the flux of atomic oxygen in the APPJ effluent as measured using laser-based diagnostics (TALIF).
Original languageEnglish
Title of host publicationProceedings of the 22nd International Symposium on Plasma Chemistry, 5-10 July 2015, Antwerp, Belgium
Pages1-4
Number of pages4
Publication statusPublished - 2015
Event22nd International Symposium on Plasma Chemistry (ISPC 22), July 5-10, 2015, Antwerp, Belgium - Antwerp, Belgium
Duration: 5 Jul 201510 Jul 2015
https://www.uantwerpen.be/en/conferences/ispc22/

Conference

Conference22nd International Symposium on Plasma Chemistry (ISPC 22), July 5-10, 2015, Antwerp, Belgium
Abbreviated titleISPC 22
CountryBelgium
CityAntwerp
Period5/07/1510/07/15
Internet address

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