Optimal actuator shape design with input and state constraints for a wafer heating application

D.W.M. Veldman, R.H.B. Fey, H.J. Zwart, M.M.J. van de Wal, J.D.B.J. van den Boom, H. Nijmeijer

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Abstract

Thermal actuation can reduce deterioration of the imaging quality due to wafer heating. Because the placement of thermal actuators is critical for the performance of the resulting control system, a method to aid the design of an actuator layout is developed. Optimal actuator shapes are computed as the solution of an optimization problem that involves input and state constraints. The resulting actuator shapes have a clear physical interpretation for the next-generation wafer scanners and numerical results seem to indicate that the designed actuator shapes might be unique.

Original languageEnglish
Title of host publication2019 American Control Conference, ACC 2019
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages3789-3794
Number of pages6
ISBN (Electronic)978-1-5386-7926-5
DOIs
Publication statusPublished - 1 Jul 2019
Event2019 American Control Conference, ACC 2019 - Philadelphia, United States
Duration: 10 Jul 201912 Jul 2019
http://acc2019.a2c2.org

Conference

Conference2019 American Control Conference, ACC 2019
Abbreviated titleACC2019
CountryUnited States
CityPhiladelphia
Period10/07/1912/07/19
Internet address

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