Abstract
Thermal actuation can reduce deterioration of the imaging quality due to wafer heating. Because the placement of thermal actuators is critical for the performance of the resulting control system, a method to aid the design of an actuator layout is developed. Optimal actuator shapes are computed as the solution of an optimization problem that involves input and state constraints. The resulting actuator shapes have a clear physical interpretation for the next-generation wafer scanners and numerical results seem to indicate that the designed actuator shapes might be unique.
Original language | English |
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Title of host publication | 2019 American Control Conference, ACC 2019 |
Place of Publication | Piscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | 3789-3794 |
Number of pages | 6 |
ISBN (Electronic) | 978-1-5386-7926-5 |
DOIs | |
Publication status | Published - 1 Jul 2019 |
Event | 2019 American Control Conference, ACC 2019 - Philadelphia, United States Duration: 10 Jul 2019 → 12 Jul 2019 http://acc2019.a2c2.org |
Conference
Conference | 2019 American Control Conference, ACC 2019 |
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Abbreviated title | ACC 2019 |
Country/Territory | United States |
City | Philadelphia |
Period | 10/07/19 → 12/07/19 |
Internet address |