Optimal actuator shape design with input and state constraints for a wafer heating application

D.W.M. Veldman; R.H.B. Fey; H.J. Zwart; M.M.J. van de Wal; J.D.B.J. van den Boom; H. Nijmeijer

doi:10.23919/acc.2019.8814819

Optimal actuator shape design with input and state constraints for a wafer heating application

D.W.M. Veldman, R.H.B. Fey, H.J. Zwart, M.M.J. van de Wal, J.D.B.J. van den Boom, H. Nijmeijer

Dynamics and Control

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

Thermal actuation can reduce deterioration of the imaging quality due to wafer heating. Because the placement of thermal actuators is critical for the performance of the resulting control system, a method to aid the design of an actuator layout is developed. Optimal actuator shapes are computed as the solution of an optimization problem that involves input and state constraints. The resulting actuator shapes have a clear physical interpretation for the next-generation wafer scanners and numerical results seem to indicate that the designed actuator shapes might be unique.

Original language	English
Title of host publication	2019 American Control Conference, ACC 2019
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	3789-3794
Number of pages	6
ISBN (Electronic)	978-1-5386-7926-5
DOIs	https://doi.org/10.23919/acc.2019.8814819
Publication status	Published - 1 Jul 2019
Event	2019 American Control Conference (ACC 2019) - Philadelphia, United States Duration: 10 Jul 2019 → 12 Jul 2019 http://acc2019.a2c2.org

Conference

Conference	2019 American Control Conference (ACC 2019)
Abbreviated title	ACC2019
Country/Territory	United States
City	Philadelphia
Period	10/07/19 → 12/07/19
Internet address	http://acc2019.a2c2.org

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10.23919/acc.2019.8814819

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Veldman, D. W. M., Fey, R. H. B., Zwart, H. J., van de Wal, M. M. J., van den Boom, J. D. B. J., & Nijmeijer, H. (2019). Optimal actuator shape design with input and state constraints for a wafer heating application. In 2019 American Control Conference, ACC 2019 (pp. 3789-3794). [8814819] Institute of Electrical and Electronics Engineers. https://doi.org/10.23919/acc.2019.8814819

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title = "Optimal actuator shape design with input and state constraints for a wafer heating application",

abstract = "Thermal actuation can reduce deterioration of the imaging quality due to wafer heating. Because the placement of thermal actuators is critical for the performance of the resulting control system, a method to aid the design of an actuator layout is developed. Optimal actuator shapes are computed as the solution of an optimization problem that involves input and state constraints. The resulting actuator shapes have a clear physical interpretation for the next-generation wafer scanners and numerical results seem to indicate that the designed actuator shapes might be unique.",

author = "D.W.M. Veldman and R.H.B. Fey and H.J. Zwart and {van de Wal}, M.M.J. and {van den Boom}, J.D.B.J. and H. Nijmeijer",

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doi = "10.23919/acc.2019.8814819",

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Veldman, DWM, Fey, RHB , Zwart, HJ, van de Wal, MMJ, van den Boom, JDBJ & Nijmeijer, H 2019, Optimal actuator shape design with input and state constraints for a wafer heating application. in 2019 American Control Conference, ACC 2019., 8814819, Institute of Electrical and Electronics Engineers, Piscataway, pp. 3789-3794, 2019 American Control Conference (ACC 2019), Philadelphia, Pennsylvania, United States, 10/07/19. https://doi.org/10.23919/acc.2019.8814819

Optimal actuator shape design with input and state constraints for a wafer heating application. / Veldman, D.W.M.; Fey, R.H.B.; Zwart, H.J. et al.

2019 American Control Conference, ACC 2019. Piscataway : Institute of Electrical and Electronics Engineers, 2019. p. 3789-3794 8814819.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Optimal actuator shape design with input and state constraints for a wafer heating application

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