Optical transceiver ICs based on 3D die-stacking of optoelectronic devices

H.J.S. Dorren, P. Duan, O. Raz

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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Abstract

Based on Amdahl scaling of tree-networks, we show that in the next 10 years power efficiency and cost of data center communication networks have to improve with three orders of magnitude. Flattened network architectures may allow for more efficient scaling but require high-radix network switches. In turn, such switches will require opto-electronic conversion in close proximity of the switch ASIC. In this paper, we focus on three-dimensional die-stacked transceiver ICs that allow for low cost fabrication and packaging that may enable flattened network architectures based on highradix switches.
Original languageEnglish
Title of host publicationSmart photonic and optoelectronic integrated circuits XVI, 1-6 February 2014, San Francisco, California
EditorsL.A. Eldada, E-H Lee, S. He
Place of PublicationBellingham, USA
PublisherSPIE
Pages898909-1-898909-7
ISBN (Print)9780819499028
DOIs
Publication statusPublished - 2014
EventSmart Photonic and Optoelectronic Integrated Circuits XVI, February 5-6, 2014, San Francisco, CA, USA - San Francisco, CA, United States
Duration: 1 Feb 20146 Feb 2014

Publication series

NameProceedings of SPIE
Volume8989
ISSN (Print)0277-786X

Conference

ConferenceSmart Photonic and Optoelectronic Integrated Circuits XVI, February 5-6, 2014, San Francisco, CA, USA
CountryUnited States
CitySan Francisco, CA
Period1/02/146/02/14
OtherPhotonics West 2014

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  • Cite this

    Dorren, H. J. S., Duan, P., & Raz, O. (2014). Optical transceiver ICs based on 3D die-stacking of optoelectronic devices. In L. A. Eldada, E-H. Lee, & S. He (Eds.), Smart photonic and optoelectronic integrated circuits XVI, 1-6 February 2014, San Francisco, California (pp. 898909-1-898909-7). (Proceedings of SPIE; Vol. 8989). SPIE. https://doi.org/10.1117/12.2042417