@inproceedings{b729ede39631419bb0f7ac7efbd02895,
title = "Optical transceiver ICs based on 3D die-stacking of optoelectronic devices",
abstract = "Based on Amdahl scaling of tree-networks, we show that in the next 10 years power efficiency and cost of data center communication networks have to improve with three orders of magnitude. Flattened network architectures may allow for more efficient scaling but require high-radix network switches. In turn, such switches will require opto-electronic conversion in close proximity of the switch ASIC. In this paper, we focus on three-dimensional die-stacked transceiver ICs that allow for low cost fabrication and packaging that may enable flattened network architectures based on highradix switches.",
author = "H.J.S. Dorren and P. Duan and O. Raz",
year = "2014",
doi = "10.1117/12.2042417",
language = "English",
isbn = "9780819499028",
series = "Proceedings of SPIE",
publisher = "SPIE",
pages = "898909--1--898909--7",
editor = "L.A. Eldada and E-H Lee and S. He",
booktitle = "Smart photonic and optoelectronic integrated circuits XVI, 1-6 February 2014, San Francisco, California",
address = "United States",
note = "Smart Photonic and Optoelectronic Integrated Circuits XVI, February 5-6, 2014, San Francisco, CA, USA ; Conference date: 01-02-2014 Through 06-02-2014",
}