Optical transceiver ICs based on 3D die-stacking of opto-electronic devices

P. Duan; O. Raz; B.E. Smalbrugge; K.L. Plassche, van de; H.J.S. Dorren

doi:10.1109/IPCon.2013.6656663

Optical transceiver ICs based on 3D die-stacking of opto-electronic devices

P. Duan
, O. Raz
, B.E. Smalbrugge
, K.L. Plassche, van de
, H.J.S. Dorren

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Abstract

Wafer scale fabrication of the 3D stacked transceivers is discussed. Uniform open eye patterns at 10 Gb/s/channel of both 3D stacked transmitter and receiver ICs indicates that the interconnection technology is robust.

Original language	English
Title of host publication	Proceedings of the 2013 IEEE Photonics Conference (IPC), 8-12 September 2013, Bellevue, Washington
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	515-516
ISBN (Print)	978-1-4577-1506-8
DOIs	https://doi.org/10.1109/IPCon.2013.6656663
Publication status	Published - 2013

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Duan, P., Raz, O., Smalbrugge, B. E., Plassche, van de, K. L., & Dorren, H. J. S. (2013). Optical transceiver ICs based on 3D die-stacking of opto-electronic devices. In Proceedings of the 2013 IEEE Photonics Conference (IPC), 8-12 September 2013, Bellevue, Washington (pp. 515-516). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/IPCon.2013.6656663

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title = "Optical transceiver ICs based on 3D die-stacking of opto-electronic devices",

abstract = "Wafer scale fabrication of the 3D stacked transceivers is discussed. Uniform open eye patterns at 10 Gb/s/channel of both 3D stacked transmitter and receiver ICs indicates that the interconnection technology is robust.",

author = "P. Duan and O. Raz and B.E. Smalbrugge and \{Plassche, van de\}, K.L. and H.J.S. Dorren",

year = "2013",

doi = "10.1109/IPCon.2013.6656663",

language = "English",

isbn = "978-1-4577-1506-8",

pages = "515--516",

booktitle = "Proceedings of the 2013 IEEE Photonics Conference (IPC), 8-12 September 2013, Bellevue, Washington",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

}

Duan, P, Raz, O, Smalbrugge, BE, Plassche, van de, KL & Dorren, HJS 2013, Optical transceiver ICs based on 3D die-stacking of opto-electronic devices. in Proceedings of the 2013 IEEE Photonics Conference (IPC), 8-12 September 2013, Bellevue, Washington. Institute of Electrical and Electronics Engineers, Piscataway, pp. 515-516. https://doi.org/10.1109/IPCon.2013.6656663

Optical transceiver ICs based on 3D die-stacking of opto-electronic devices. / Duan, P.; Raz, O.; Smalbrugge, B.E. et al.
Proceedings of the 2013 IEEE Photonics Conference (IPC), 8-12 September 2013, Bellevue, Washington. Piscataway: Institute of Electrical and Electronics Engineers, 2013. p. 515-516.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - Duan, P.

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AU - Smalbrugge, B.E.

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AU - Dorren, H.J.S.

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DO - 10.1109/IPCon.2013.6656663

M3 - Conference contribution

SN - 978-1-4577-1506-8

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BT - Proceedings of the 2013 IEEE Photonics Conference (IPC), 8-12 September 2013, Bellevue, Washington

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

ER -

Optical transceiver ICs based on 3D die-stacking of opto-electronic devices

Abstract

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