Optical transceiver ICs based on 3D die-stacking of opto-electronic devices

P. Duan; O. Raz; H.J.S. Dorren

Optical transceiver ICs based on 3D die-stacking of opto-electronic devices

P. Duan, O. Raz, H.J.S. Dorren

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Abstract

We review a wafer-scale process for making compact 3D stacked transmitter and receivers ICs. We show experimental results that indicate that error-free operation of the transmitter at 10 Gbps can be obtained over 500m transmission through OM4-Plus fiber.

Original language	English
Title of host publication	Proceedings CLEO-PR & OECC/PS 2013, 30 June - 4 July 2013, Kyoto, Japan
Pages	1-2
Publication status	Published - 2013

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title = "Optical transceiver ICs based on 3D die-stacking of opto-electronic devices",

abstract = "We review a wafer-scale process for making compact 3D stacked transmitter and receivers ICs. We show experimental results that indicate that error-free operation of the transmitter at 10 Gbps can be obtained over 500m transmission through OM4-Plus fiber.",

author = "P. Duan and O. Raz and H.J.S. Dorren",

year = "2013",

language = "English",

pages = "1--2",

booktitle = "Proceedings CLEO-PR & OECC/PS 2013, 30 June - 4 July 2013, Kyoto, Japan",

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TY - GEN

T1 - Optical transceiver ICs based on 3D die-stacking of opto-electronic devices

AU - Duan, P.

AU - Raz, O.

AU - Dorren, H.J.S.

PY - 2013

Y1 - 2013

N2 - We review a wafer-scale process for making compact 3D stacked transmitter and receivers ICs. We show experimental results that indicate that error-free operation of the transmitter at 10 Gbps can be obtained over 500m transmission through OM4-Plus fiber.

AB - We review a wafer-scale process for making compact 3D stacked transmitter and receivers ICs. We show experimental results that indicate that error-free operation of the transmitter at 10 Gbps can be obtained over 500m transmission through OM4-Plus fiber.

M3 - Conference contribution

SP - 1

EP - 2

BT - Proceedings CLEO-PR & OECC/PS 2013, 30 June - 4 July 2013, Kyoto, Japan

ER -

Optical transceiver ICs based on 3D die-stacking of opto-electronic devices

Abstract

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