Optical transceiver ICs based on 3D die-stacking of opto-electronic devices

P. Duan, O. Raz, B.E. Smalbrugge, K.L. Plassche, van de, H.J.S. Dorren

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Abstract

Wafer scale fabrication of the 3D stacked transceivers is discussed. Uniform open eye patterns at 10 Gb/s/channel of both 3D stacked transmitter and receiver ICs indicates that the interconnection technology is robust.
Original languageEnglish
Title of host publicationProceedings of the 2013 IEEE Photonics Conference (IPC), 8-12 September 2013, Bellevue, Washington
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages515-516
ISBN (Print)978-1-4577-1506-8
DOIs
Publication statusPublished - 2013

Fingerprint Dive into the research topics of 'Optical transceiver ICs based on 3D die-stacking of opto-electronic devices'. Together they form a unique fingerprint.

Cite this