Open standards for automation of testing of photonic integrated circuits

Sylwester Latkowski (Corresponding author), Dzmitry Pustakhod, Michail Chatzimichailidis, Weiming Yao, Xaveer Leijtens

Research output: Contribution to journalArticleAcademicpeer-review

Abstract

Foundry services for photonic integration enable access to such technologies and facilitate fab-less businesses models. The technologies are sufficiently mature for proof-of-concept demonstrators, advanced prototypes and small-to-medium volume production. Further improvement of the technology processes behind those services requires extensive research and development efforts in order to advance the foundry offerings and assure scalability, process control and yield required for volume production. A high-level automation of test and assembly processes in the PIC manufacturing chain is essential to improve statistical process control and scalability of all processes. These allow for early known-good-die identification, optimization of fabrication process window, improved yield and volume production. In this paper we propose a standardized approach to chip layout that supports automated test and assembly processes already at the design phase. Moreover, we describe a modular test software framework based on open standards. Within this test framework, standard file formats for chip, equipment and measurement description, and the open file formats for storage and exchange of data are described. This test framework is a part of the openEPDA initiative and enables test automation, user-defined testing, data analysis, exchangeability and traceability across the full manufacturing chain from design to product.

LanguageEnglish
JournalIEEE Journal of Selected Topics in Quantum Electronics
Volume25
Issue number5
DOIs
StatePublished - 6 Jun 2019

Fingerprint

automation
Photonics
integrated circuits
Integrated circuits
Automation
photonics
Foundries
Scalability
Testing
Statistical process control
foundries
Process control
files
format
manufacturing
assembly
Fabrication
chips
research and development
Industry

Keywords

  • photonic integrated circuits
  • photonic integration
  • test
  • test automation

Cite this

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abstract = "Foundry services for photonic integration enable access to such technologies and facilitate fab-less businesses models. The technologies are sufficiently mature for proof-of-concept demonstrators, advanced prototypes and small-to-medium volume production. Further improvement of the technology processes behind those services requires extensive research and development efforts in order to advance the foundry offerings and assure scalability, process control and yield required for volume production. A high-level automation of test and assembly processes in the PIC manufacturing chain is essential to improve statistical process control and scalability of all processes. These allow for early known-good-die identification, optimization of fabrication process window, improved yield and volume production. In this paper we propose a standardized approach to chip layout that supports automated test and assembly processes already at the design phase. Moreover, we describe a modular test software framework based on open standards. Within this test framework, standard file formats for chip, equipment and measurement description, and the open file formats for storage and exchange of data are described. This test framework is a part of the openEPDA initiative and enables test automation, user-defined testing, data analysis, exchangeability and traceability across the full manufacturing chain from design to product.",
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