Abstract
Test, assembly and packaging processes substantially contribute to the overall production cost of photonic integrated circuits. Implementation of test processes across the full production chain is critical in order to deliver statistically significant data sets. These will allow for optimization of the fabrication process widows, early known-good-die selection, improved models in design tools and lead to improved yield, reduced cost and scalability which will open a path to volume production. Progress on developments of open access test infrastructure at our laboratories and open standard test framework will be presented.
Original language | English |
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Title of host publication | 21st International Conference on Transparent Optical Networks, ICTON 2019 |
Place of Publication | Piscataway |
Publisher | IEEE Computer Society |
Number of pages | 4 |
ISBN (Electronic) | 9781728127798 |
DOIs | |
Publication status | Published - 1 Jul 2019 |
Event | 21st International Conference on Transparent Optical Networks (ICTON 2019) - Angers, France Duration: 9 Jul 2019 → 13 Jul 2019 http://www.icton2019.com/index.php |
Conference
Conference | 21st International Conference on Transparent Optical Networks (ICTON 2019) |
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Abbreviated title | ICTON2019 |
Country/Territory | France |
City | Angers |
Period | 9/07/19 → 13/07/19 |
Internet address |
Keywords
- Integrated photonics
- Photonic integrated circuits
- Photonic integration
- Test
- Test automation