Open innovation development for photonic integration technology: a practical case of RF interconnects

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Abstract

Photonic integrated circuit (PIC) platforms are in continuous development to offer higher performance and increased functionality. Through an open innovation model for photonics, developments for next technology nodes can be carried out within a collaborative framework. As an example, we present a case in which we develop low loss radio-frequency interconnects for an InP foundry partner. The technology development is expected to enable high modulation data rates using a generic PIC platform.

Original languageEnglish
Title of host publication2018 20th International Conference on Transparent Optical Networks, ICTON 2018
Place of PublicationPiscataway
PublisherIEEE Computer Society
Number of pages4
ISBN (Electronic)978-1-5386-6605-0
ISBN (Print)978-1-5386-6606-7
DOIs
Publication statusPublished - 26 Sep 2018
Event20th International Conference on Transparent Optical Networks, (ICTON2018) - Bucharest, Romania
Duration: 1 Jul 20185 Jul 2018
https://www.itl.waw.pl/en/conferences/icton/299-icton-2018/1505-icton-2018-preliminary-programme

Conference

Conference20th International Conference on Transparent Optical Networks, (ICTON2018)
Abbreviated titleICTON2018
CountryRomania
CityBucharest
Period1/07/185/07/18
Internet address

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Keywords

  • open innovation
  • photonic integrated circuits
  • photonic integration

Cite this

Dolores-Calzadilla, V., Yao, W., de Vries, T., & Williams, K. (2018). Open innovation development for photonic integration technology: a practical case of RF interconnects. In 2018 20th International Conference on Transparent Optical Networks, ICTON 2018 [8473906] Piscataway: IEEE Computer Society. https://doi.org/10.1109/ICTON.2018.8473906