Open innovation development for photonic integration technology: a practical case of RF interconnects

Victor Dolores-Calzadilla; Weiming Yao; Tjibbe  de Vries; Kevin Williams

doi:10.1109/ICTON.2018.8473906

Open innovation development for photonic integration technology: a practical case of RF interconnects

Victor Dolores-Calzadilla, Weiming Yao, Tjibbe de Vries, Kevin Williams

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

2 Downloads (Pure)

Abstract

Photonic integrated circuit (PIC) platforms are in continuous development to offer higher performance and increased functionality. Through an open innovation model for photonics, developments for next technology nodes can be carried out within a collaborative framework. As an example, we present a case in which we develop low loss radio-frequency interconnects for an InP foundry partner. The technology development is expected to enable high modulation data rates using a generic PIC platform.

Original language	English
Title of host publication	2018 20th International Conference on Transparent Optical Networks, ICTON 2018
Place of Publication	Piscataway
Publisher	IEEE Computer Society
Number of pages	4
ISBN (Electronic)	978-1-5386-6605-0
ISBN (Print)	978-1-5386-6606-7
DOIs	https://doi.org/10.1109/ICTON.2018.8473906
Publication status	Published - 26 Sept 2018
Event	20th International Conference on Transparent Optical Networks, (ICTON 2018) - Bucharest, Romania Duration: 1 Jul 2018 → 5 Jul 2018 Conference number: 20 https://www.itl.waw.pl/en/conferences/icton/299-icton-2018/1505-icton-2018-preliminary-programme

Conference

Conference	20th International Conference on Transparent Optical Networks, (ICTON 2018)
Abbreviated title	ICTON2018
Country/Territory	Romania
City	Bucharest
Period	1/07/18 → 5/07/18
Internet address	https://www.itl.waw.pl/en/conferences/icton/299-icton-2018/1505-icton-2018-preliminary-programme

Keywords

open innovation
photonic integrated circuits
photonic integration

Access to Document

10.1109/ICTON.2018.8473906

Cite this

@inproceedings{0b6a286d4996419b94cb36b4e31cddc0,

title = "Open innovation development for photonic integration technology: a practical case of RF interconnects",

abstract = "Photonic integrated circuit (PIC) platforms are in continuous development to offer higher performance and increased functionality. Through an open innovation model for photonics, developments for next technology nodes can be carried out within a collaborative framework. As an example, we present a case in which we develop low loss radio-frequency interconnects for an InP foundry partner. The technology development is expected to enable high modulation data rates using a generic PIC platform.",

keywords = "open innovation, photonic integrated circuits, photonic integration",

author = "Victor Dolores-Calzadilla and Weiming Yao and {de Vries}, Tjibbe and Kevin Williams",

year = "2018",

month = sep,

day = "26",

doi = "10.1109/ICTON.2018.8473906",

language = "English",

isbn = "978-1-5386-6606-7",

booktitle = "2018 20th International Conference on Transparent Optical Networks, ICTON 2018",

publisher = "IEEE Computer Society",

address = "United States",

note = "20th International Conference on Transparent Optical Networks, (ICTON 2018), ICTON2018 ; Conference date: 01-07-2018 Through 05-07-2018",

url = "https://www.itl.waw.pl/en/conferences/icton/299-icton-2018/1505-icton-2018-preliminary-programme",

}

Dolores-Calzadilla, V , Yao, W, de Vries, T & Williams, K 2018, Open innovation development for photonic integration technology: a practical case of RF interconnects. in 2018 20th International Conference on Transparent Optical Networks, ICTON 2018., 8473906, IEEE Computer Society, Piscataway, 20th International Conference on Transparent Optical Networks, (ICTON 2018), Bucharest, Romania, 1/07/18. https://doi.org/10.1109/ICTON.2018.8473906

Open innovation development for photonic integration technology: a practical case of RF interconnects. / Dolores-Calzadilla, Victor ; Yao, Weiming; de Vries, Tjibbe et al.
2018 20th International Conference on Transparent Optical Networks, ICTON 2018. Piscataway: IEEE Computer Society, 2018. 8473906.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Open innovation development for photonic integration technology

T2 - 20th International Conference on Transparent Optical Networks, (ICTON 2018)

AU - Dolores-Calzadilla, Victor

AU - Yao, Weiming

AU - de Vries, Tjibbe

AU - Williams, Kevin

N1 - Conference code: 20

PY - 2018/9/26

Y1 - 2018/9/26

N2 - Photonic integrated circuit (PIC) platforms are in continuous development to offer higher performance and increased functionality. Through an open innovation model for photonics, developments for next technology nodes can be carried out within a collaborative framework. As an example, we present a case in which we develop low loss radio-frequency interconnects for an InP foundry partner. The technology development is expected to enable high modulation data rates using a generic PIC platform.

AB - Photonic integrated circuit (PIC) platforms are in continuous development to offer higher performance and increased functionality. Through an open innovation model for photonics, developments for next technology nodes can be carried out within a collaborative framework. As an example, we present a case in which we develop low loss radio-frequency interconnects for an InP foundry partner. The technology development is expected to enable high modulation data rates using a generic PIC platform.

KW - open innovation

KW - photonic integrated circuits

KW - photonic integration

UR - http://www.scopus.com/inward/record.url?scp=85055550118&partnerID=8YFLogxK

U2 - 10.1109/ICTON.2018.8473906

DO - 10.1109/ICTON.2018.8473906

M3 - Conference contribution

AN - SCOPUS:85055550118

SN - 978-1-5386-6606-7

BT - 2018 20th International Conference on Transparent Optical Networks, ICTON 2018

PB - IEEE Computer Society

CY - Piscataway

Y2 - 1 July 2018 through 5 July 2018

ER -

Open innovation development for photonic integration technology: a practical case of RF interconnects

Abstract

Conference

Keywords

Access to Document

Other files and links

Fingerprint

Cite this