TY - JOUR
T1 - Once-through contactless flow boiling in a micro evaporator
AU - Rops, C.M.
AU - Oosterbaan, G.J.
AU - Geld, van der, C.W.M.
PY - 2014
Y1 - 2014
N2 - Equipment miniaturization offers several opportunities such as an increased surface-to-volume ratio combined with high heat transfer coefficients. However, moving towards small-diameter channels demands extra attention to fouling, reliability and stable operation of the system. The present investigation explores the possibilities of hot gas flow through the porous wall of a pipe as a means to evaporate a liquid flowing in the pipe fully. A reduction of the pressure fluctuations of about 30 to 40% is obtained with this so-called contactless boiling. Because of the injected gas, wall temperatures measured are higher. The reduction in heat transfer coefficient corresponds to an insulating gas layer at the wall with an estimated thickness of 20 ¿m.
AB - Equipment miniaturization offers several opportunities such as an increased surface-to-volume ratio combined with high heat transfer coefficients. However, moving towards small-diameter channels demands extra attention to fouling, reliability and stable operation of the system. The present investigation explores the possibilities of hot gas flow through the porous wall of a pipe as a means to evaporate a liquid flowing in the pipe fully. A reduction of the pressure fluctuations of about 30 to 40% is obtained with this so-called contactless boiling. Because of the injected gas, wall temperatures measured are higher. The reduction in heat transfer coefficient corresponds to an insulating gas layer at the wall with an estimated thickness of 20 ¿m.
U2 - 10.1615/InterfacPhenomHeatTransfer.2015011652
DO - 10.1615/InterfacPhenomHeatTransfer.2015011652
M3 - Article
SN - 2169-2785
VL - 2
SP - 265
EP - 271
JO - Interfacial Phenomena and Heat Transfer
JF - Interfacial Phenomena and Heat Transfer
IS - 3
ER -