On the role of surface diffusion and its relation to the hydrogen incorporation during hydrogenated amorphous silicon growth

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Abstract

The incorporation of hydrogen in vacancies and at void surfaces during hydrogenated amorphous silicon growth from a remote expanding thermal plasma (ETP) is systematically studied by variation of the mass growth flux Gamma a-Si:H and substrate temp. Tsub. An evident relation between the void incorporation and the growth parameters Gamma a-Si:H and Tsub has been obsd. The authors speculate on a possible relation with the surface diffusion processes during deposition. An activation energy for surface diffusion during a-Si:H growth of 0.8-1.1 eV is obtained using this assertion, similar to the activation energy deduced from surface roughness evolution studies. For compact films hydrogen is predominantly present at vacancies, and a possible relation with the hydrogen removal mechanism during deposition is discussed.
Original languageEnglish
Title of host publicationAmorphous and nanocrystalline silicon-based films - 2003 : symposium held April 22-25, 2003, San Francisco, California, USA
EditorsJ.R. Abelson
Place of PublicationWarrendale
PublisherMaterials Research Society
Pages461-466
ISBN (Print)1-558-99699-0
Publication statusPublished - 2003

Publication series

NameMaterials Research Society Symposium Proceedings
Volume762
ISSN (Print)0272-9172

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