Abstract
Negative Bias Temperature Instability (NBTI) is suspected to be linked to various other MOSFET phenomena. We report measurements of increased drain current noise, increased gate leakage current, and decreased recoverable threshold voltage shift after multiple cycles of negative bias temperature stress and relaxation for three different technologies. We also find that stress conditions have to be carefully selected, otherwise oxide breakdown will be erroneously interpreted as a correlation between NBTI, noise and gate leakage. Finally, the implications of our findings on the modelling of oxide defects are highlighted.
Original language | English |
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Title of host publication | 2012 IEEE International Integrated Reliability Workshop Final Report, IIRW 2012 |
Place of Publication | Piscataway |
Pages | 60-64 |
Number of pages | 5 |
DOIs | |
Publication status | Published - 1 Dec 2012 |
Event | 2012 IEEE International Integrated Reliability Workshop, IIRW 2012 - South Lake Tahoe, CA, United States Duration: 14 Oct 2012 → 18 Oct 2012 |
Conference
Conference | 2012 IEEE International Integrated Reliability Workshop, IIRW 2012 |
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Country/Territory | United States |
City | South Lake Tahoe, CA |
Period | 14/10/12 → 18/10/12 |