On-Chip thermal crosstalk reduction in InP-based photonic integrated circuits

G. Gilardi, W. Yao, M.K. Smit, M.J. Wale

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Abstract

We fabricated deep trenches to modify the heat transfer path coming from active components. Current injected in active components and trenches geometry are the parameters considered. We demonstrate how the trenches reduce the thermal crosstalk.
Original languageEnglish
Title of host publicationConference Paper Integrated Photonics Research, Silicon and Nanophotonics, San Diego, California United States, July 13-17, 2014
PublisherOptical Society of America (OSA)
ISBN (Print)978-1-55752-737-0
DOIs
Publication statusPublished - 2014

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