Numerical analysis of the reliability of Cu/low-k bond pad interconnections under wire pull test: application of a 3D energy based failure criterion

S. Gallois-Garreignot, V. Fiori, S. Orain, O. Sluis, van der

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

4 Citations (Scopus)

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Earth & Environmental Sciences