Nozzle for high-speed jetting devices

G. Nisato (Inventor), F. Roozeboom (Inventor), J.E.J.M. Rubingh (Inventor), W. Dekkers (Inventor)

Research output: PatentPatent publication


A nozzle for jetting devices is described comprising e.g. one patterned silicon substrate enabling semiconductor mass prodn. The method of manufg. the nozzle is characterized by using one mask layer deposited on the silicon substrate. The etching of the silicon substrate is done by means of a first isotropic etching step and a second anisotropic etching step through the mask layer, resulting in a perfectly aligned nozzle. [on SciFinder (R)]
Original languageEnglish
Patent numberWO2008050287
Publication statusPublished - 2 May 2008


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