Novel wafer-scale adhesive bonding with improved alignment accuracy and bond uniformity

Salim Abdi (Corresponding author), Tjibbe de Vries, Marc Spiegelberg, Kevin A. Williams, Yuqing Jiao

Research output: Contribution to journalArticleAcademicpeer-review

3 Citations (Scopus)
255 Downloads (Pure)

Abstract

We report a versatile method for improving post-bonding wafer alignment accuracy and BCB thickness uniformity in stacks bonded with soft-baked BCB. It is based on novel BCB-based micro-pillars that act as anchors during bonding. The anchor structures become a natural part of the bonding interface therefore causing minimal interference to the optical, electrical and mechanical properties of the bonded stack. We studied these properties for fixed anchor density and various anchor heights with respect to the adhesive BCB thickness. We demonstrated that the alignment accuracy can be improved by approximately an order of magnitude and approach the fundamental pre-bond alignment accuracy by the tool. We also demonstrated that this technique is effective for a large range of BCB thicknesses of 2–16 μm. Furthermore we observed that the thickness non-uniformities were reduced by a factor of 2–3 × for BCB thicknesses in the 8–16 μm range.
Original languageEnglish
Article number111936
Number of pages7
JournalMicroelectronic Engineering
Volume270
DOIs
Publication statusPublished - 1 Feb 2023

Funding

This work was supported by the H2020 ICT TWILIGHT Project (contract No. 781471 ) under the Photonics PPP.

FundersFunder number
European H2020 ICT TWILIGHT781471

    Keywords

    • 3D integration
    • Adhesive bonding
    • Alignment accuracy
    • Heterogeneous integration
    • Process uniformity

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