Novel wafer-scale adhesive bonding with improved alignment accuracy and bond uniformity

We report a versatile method for improving post-bonding wafer alignment accuracy and BCB thickness uniformity in stacks bonded with soft-baked BCB. It is based on novel BCB-based micro-pillars that act as anchors during bonding. The anchor structures become a natural part of the bonding interface therefore causing minimal interference to the optical, electrical and mechanical properties of the bonded stack. We studied these properties for fixed anchor density and various anchor heights with respect to the adhesive BCB thickness. We demonstrated that the alignment accuracy can be improved by approximately an order of magnitude and approach the fundamental pre-bond alignment accuracy by the tool. We also demonstrated that this technique is effective for a large range of BCB thicknesses of 2–16 μm. Furthermore we observed that the thickness non-uniformities were reduced by a factor of 2–3 × for BCB thicknesses in the 8–16 μm range.