Novel damage model for delamination in Cu/low-k IC backend structures

M. A.J. Van Gils, O. Van Der Sluis, G. Q. Zhang, J. H.J. Janssen, R. M.J. Voncken

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

4 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds