Novel 3D die-stacked opto-electronic transciever ICs that allow for waferscale fabrication

P. Duan, O. Raz, H.J.S. Dorren

Research output: Other contributionOther research output

Original languageEnglish
PublisherInstitute of Electrical and Electronics Engineers
Place of PublicationPiscataway
Publication statusPublished - 2013

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