| Original language | English |
|---|---|
| Publisher | Institute of Electrical and Electronics Engineers |
| Place of Publication | Piscataway |
| Publication status | Published - 2013 |
Novel 3D die-stacked opto-electronic transciever ICs that allow for waferscale fabrication
P. Duan, O. Raz, H.J.S. Dorren
Research output: Other contribution › Other research output