Novel 3D die-stacked opto-electronic transceiver ICs that allow for wafer-scale fabrication: application in switches and router

P. Duan, O. Raz, Barry E. Smalbrugge, H.J.S. Dorren

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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Original languageEnglish
Title of host publicationProceedings of the 18th Microoptics Conference (MOC 2013), 27-30 October 2013, Tokyo, Japan
Publication statusPublished - 2013

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