Multiscale modelling of multilayer substrates

R.L.J.M. Ubachs; O. Sluis, van der; W.D. Driel, van; G.Q. Zhang

doi:10.1016/j.microrel.2006.07.013

Multiscale modelling of multilayer substrates

R.L.J.M. Ubachs, O. Sluis, van der, W.D. Driel, van, G.Q. Zhang

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Abstract

A multiscale (global-local) numerical method for the assessment of reliabilty issues in substrates is presented. The method allows for the calculation of accurate local quantities, without the need for heavy calculations. A global step is performed by first subdividing the substrate into cells. Next, the structure (circuit) of each cell is analysed and quantified and, based on the result, appropriate effective properties are assigned. In this way a homogenised finite element model of the substrate is constructed which is used to determine its global response. A local step is subsequently performed, where only a small region of interest of the substrate is modelled in detail. The loading is accomplished by describing boundary conditions extracted from the global simulation.

Original language	English
Pages (from-to)	1472-1477
Journal	Microelectronics Reliability
Volume	46
Issue number	9-11
DOIs	https://doi.org/10.1016/j.microrel.2006.07.013
Publication status	Published - 2006

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10.1016/j.microrel.2006.07.013

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title = "Multiscale modelling of multilayer substrates",

abstract = "A multiscale (global-local) numerical method for the assessment of reliabilty issues in substrates is presented. The method allows for the calculation of accurate local quantities, without the need for heavy calculations. A global step is performed by first subdividing the substrate into cells. Next, the structure (circuit) of each cell is analysed and quantified and, based on the result, appropriate effective properties are assigned. In this way a homogenised finite element model of the substrate is constructed which is used to determine its global response. A local step is subsequently performed, where only a small region of interest of the substrate is modelled in detail. The loading is accomplished by describing boundary conditions extracted from the global simulation.",

author = "R.L.J.M. Ubachs and {Sluis, van der}, O. and {Driel, van}, W.D. and G.Q. Zhang",

year = "2006",

doi = "10.1016/j.microrel.2006.07.013",

language = "English",

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pages = "1472--1477",

journal = "Microelectronics Reliability",

issn = "0026-2714",

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T1 - Multiscale modelling of multilayer substrates

AU - Ubachs, R.L.J.M.

AU - Sluis, van der, O.

AU - Driel, van, W.D.

AU - Zhang, G.Q.

PY - 2006

Y1 - 2006

N2 - A multiscale (global-local) numerical method for the assessment of reliabilty issues in substrates is presented. The method allows for the calculation of accurate local quantities, without the need for heavy calculations. A global step is performed by first subdividing the substrate into cells. Next, the structure (circuit) of each cell is analysed and quantified and, based on the result, appropriate effective properties are assigned. In this way a homogenised finite element model of the substrate is constructed which is used to determine its global response. A local step is subsequently performed, where only a small region of interest of the substrate is modelled in detail. The loading is accomplished by describing boundary conditions extracted from the global simulation.

AB - A multiscale (global-local) numerical method for the assessment of reliabilty issues in substrates is presented. The method allows for the calculation of accurate local quantities, without the need for heavy calculations. A global step is performed by first subdividing the substrate into cells. Next, the structure (circuit) of each cell is analysed and quantified and, based on the result, appropriate effective properties are assigned. In this way a homogenised finite element model of the substrate is constructed which is used to determine its global response. A local step is subsequently performed, where only a small region of interest of the substrate is modelled in detail. The loading is accomplished by describing boundary conditions extracted from the global simulation.

U2 - 10.1016/j.microrel.2006.07.013

DO - 10.1016/j.microrel.2006.07.013

M3 - Article

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VL - 46

SP - 1472

EP - 1477

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 9-11

ER -

Multiscale modelling of multilayer substrates

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