Multiscale analysis of residual stresses during processing of nano-based interconnect materials

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Original language	English
Title of host publication	11th World Congress on Computational Mechanics (WCCM XI), 20-25 July 2014, Barcelona, Spain
Place of Publication	Barcelona
Publisher	IACM / ECCOMAS
Publication status	Published - 2014
Event	11th World Congress on Computational Mechanics (WCCM 2014) - Barcelona, Spain Duration: 20 Jul 2014 → 25 Jul 2014 Conference number: 11 http://www.wccm-eccm-ecfd2014.org/frontal/default.asp

Conference	11th World Congress on Computational Mechanics (WCCM 2014)
Abbreviated title	WCCM 2014
Country/Territory	Spain
City	Barcelona
Period	20/07/14 → 25/07/14
Other	Congress held jointly with the 5th European Conference on Computational Mechanics (ECCM 2014) and the 6th European Conference on Computational Fluid Dynamics (ECFD VI)
Internet address	http://www.wccm-eccm-ecfd2014.org/frontal/default.asp

Cite this

@inproceedings{4f0966b66dfe4c2cb12fa80554a481bd,

title = "Multiscale analysis of residual stresses during processing of nano-based interconnect materials",

author = "J. Zhang and V.G. Kouznetsova and \{Sluis, van der\}, O. and M.G.D. Geers",

year = "2014",

language = "English",

booktitle = "11th World Congress on Computational Mechanics (WCCM XI), 20-25 July 2014, Barcelona, Spain",

publisher = "IACM / ECCOMAS",

note = "11th World Congress on Computational Mechanics (WCCM 2014), WCCM 2014 ; Conference date: 20-07-2014 Through 25-07-2014",

url = "http://www.wccm-eccm-ecfd2014.org/frontal/default.asp",

}

Zhang, J, Kouznetsova, VG , Sluis, van der, O & Geers, MGD 2014, Multiscale analysis of residual stresses during processing of nano-based interconnect materials. in 11th World Congress on Computational Mechanics (WCCM XI), 20-25 July 2014, Barcelona, Spain. IACM / ECCOMAS, Barcelona, 11th World Congress on Computational Mechanics (WCCM 2014), Barcelona, Spain, 20/07/14.

Multiscale analysis of residual stresses during processing of nano-based interconnect materials. / Zhang, J.; Kouznetsova, V.G.; Sluis, van der, O. et al.
11th World Congress on Computational Mechanics (WCCM XI), 20-25 July 2014, Barcelona, Spain. Barcelona: IACM / ECCOMAS, 2014.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Multiscale analysis of residual stresses during processing of nano-based interconnect materials

AU - Zhang, J.

AU - Kouznetsova, V.G.

AU - Sluis, van der, O.

AU - Geers, M.G.D.

N1 - Conference code: 11

PY - 2014

Y1 - 2014

M3 - Conference contribution

BT - 11th World Congress on Computational Mechanics (WCCM XI), 20-25 July 2014, Barcelona, Spain

PB - IACM / ECCOMAS

CY - Barcelona

T2 - 11th World Congress on Computational Mechanics (WCCM 2014)

Y2 - 20 July 2014 through 25 July 2014

ER -