Multiple heat source thermal modeling and transient analysis of LEDs

Anton Alexeev (Corresponding author), Grigory Onushkin, Jean Paul Linnartz, Genevieve Martin

Research output: Contribution to journalArticleAcademicpeer-review

18 Citations (Scopus)
171 Downloads (Pure)


Thermal transient testing is widely used for LED characterization, derivation of compact models, and calibration of 3D finite element models. The traditional analysis of transient thermal measurements yields a thermal model for a single heat source. However, it appears that secondary heat sources are typically present in LED packages and significantly limit the model's precision. In this paper, we reveal inaccuracies of thermal transient measurements interpretation associated with the secondary heat sources related to the light trapped in an optical encapsulant and phosphor light conversion losses. We show that both have a significant impact on the transient response for mid-power LED packages. We present a novel methodology of a derivation and calibration of thermal models for LEDs with multiple heat sources. It can be applied not only to monochromatic LEDs but particularly also to LEDs with phosphor light conversion. The methodology enables a separate characterization of the primary pn junction thermal power source and the secondary heat sources in an LED package.

Original languageEnglish
Article number1860
Number of pages28
Issue number10
Publication statusPublished - 15 May 2019


  • Dynamic thermal compact model
  • Led
  • Multiple heat source
  • Phosphor light conversion
  • Secondary heat path
  • Silicone dome
  • Structure function
  • Thermal characterization
  • Thermal transient analysis
  • dynamic thermal compact model
  • thermal characterization
  • structure function
  • silicone dome
  • LED
  • thermal transient analysis
  • secondary heat path
  • phosphor light conversion
  • multiple heat source


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