Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs

A. Alexeev, G. Martin, G. Onushkin

Research output: Contribution to journalArticleAcademicpeer-review

9 Citations (Scopus)
2 Downloads (Pure)

Abstract

A new multiple heat path dynamic compact model extraction method for LED packages with silicone domes is proposed. The method enables separate characterization of the LEDs dome and the main heat path. It is based on thermal transient analysis of LED configurations with and without the dome. The heat paths de-embedding procedure proposed significantly increases accuracy of the LED thermal characterization compared to a typical singular heat path approach. The method is demonstrated with a representative mid-power LED. The results are validated with steady-state FEA. Suppressed estimation errors of the heat path evaluation are indicated.

Original languageEnglish
Pages (from-to)89-96
Number of pages8
JournalMicroelectronics Reliability
Volume87
DOIs
Publication statusPublished - 1 Aug 2018

Keywords

  • Dynamic thermal compact model
  • LED
  • Secondary heat path
  • Silicone dome
  • Structure function
  • Thermal characterization
  • Thermal transient analysis

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