Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs

A. Alexeev; G. Martin; G. Onushkin

doi:10.1016/j.microrel.2018.05.014

Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs

A. Alexeev, G. Martin, G. Onushkin

Research output: Contribution to journal › Article › Academic › peer-review

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Abstract

A new multiple heat path dynamic compact model extraction method for LED packages with silicone domes is proposed. The method enables separate characterization of the LEDs dome and the main heat path. It is based on thermal transient analysis of LED configurations with and without the dome. The heat paths de-embedding procedure proposed significantly increases accuracy of the LED thermal characterization compared to a typical singular heat path approach. The method is demonstrated with a representative mid-power LED. The results are validated with steady-state FEA. Suppressed estimation errors of the heat path evaluation are indicated.

Original language	English
Pages (from-to)	89-96
Number of pages	8
Journal	Microelectronics Reliability
Volume	87
DOIs	https://doi.org/10.1016/j.microrel.2018.05.014
Publication status	Published - 1 Aug 2018

Keywords

Dynamic thermal compact model
LED
Secondary heat path
Silicone dome
Structure function
Thermal characterization
Thermal transient analysis

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10.1016/j.microrel.2018.05.014

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title = "Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs",

abstract = "A new multiple heat path dynamic compact model extraction method for LED packages with silicone domes is proposed. The method enables separate characterization of the LEDs dome and the main heat path. It is based on thermal transient analysis of LED configurations with and without the dome. The heat paths de-embedding procedure proposed significantly increases accuracy of the LED thermal characterization compared to a typical singular heat path approach. The method is demonstrated with a representative mid-power LED. The results are validated with steady-state FEA. Suppressed estimation errors of the heat path evaluation are indicated.",

keywords = "Dynamic thermal compact model, LED, Secondary heat path, Silicone dome, Structure function, Thermal characterization, Thermal transient analysis",

author = "A. Alexeev and G. Martin and G. Onushkin",

year = "2018",

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doi = "10.1016/j.microrel.2018.05.014",

language = "English",

volume = "87",

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journal = "Microelectronics Reliability",

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T1 - Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs

AU - Alexeev, A.

AU - Martin, G.

AU - Onushkin, G.

PY - 2018/8/1

Y1 - 2018/8/1

N2 - A new multiple heat path dynamic compact model extraction method for LED packages with silicone domes is proposed. The method enables separate characterization of the LEDs dome and the main heat path. It is based on thermal transient analysis of LED configurations with and without the dome. The heat paths de-embedding procedure proposed significantly increases accuracy of the LED thermal characterization compared to a typical singular heat path approach. The method is demonstrated with a representative mid-power LED. The results are validated with steady-state FEA. Suppressed estimation errors of the heat path evaluation are indicated.

AB - A new multiple heat path dynamic compact model extraction method for LED packages with silicone domes is proposed. The method enables separate characterization of the LEDs dome and the main heat path. It is based on thermal transient analysis of LED configurations with and without the dome. The heat paths de-embedding procedure proposed significantly increases accuracy of the LED thermal characterization compared to a typical singular heat path approach. The method is demonstrated with a representative mid-power LED. The results are validated with steady-state FEA. Suppressed estimation errors of the heat path evaluation are indicated.

KW - Dynamic thermal compact model

KW - LED

KW - Secondary heat path

KW - Silicone dome

KW - Structure function

KW - Thermal characterization

KW - Thermal transient analysis

UR - http://www.scopus.com/inward/record.url?scp=85048275156&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2018.05.014

DO - 10.1016/j.microrel.2018.05.014

M3 - Article

AN - SCOPUS:85048275156

SN - 0026-2714

VL - 87

SP - 89

EP - 96

JO - Microelectronics Reliability

JF - Microelectronics Reliability

ER -

Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs

Abstract

Keywords

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