Multi-scale numerical-experimental analysis of failure in solder alloys

M.G.D. Geers, R.L.J.M. Ubachs, M.E. Erinc, M.A. Matin

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The past years have triggered considerable scientific efforts towards the predictive analysis of the reliability of solder connections in micro-electronics. Undoubtedly, the replacement of the classical Sn-Pb solder alloy by a lead-free alternative constitutes the main motivation for this. This paper concentrates on the theoretical, computational and experimental multi-scale analysis of the microstructure evolution and degradation of the conventional solder material Sn-Pb and its most promising lead-free alternative, a Sn-Ag-Cu (SAC) alloy. Special attention is given to the thermal anisotropy of bulk SAC and the interfacial fatigue failure of SAC interconnects.
Original languageEnglish
Pages (from-to)66-73
JournalMaterials Science Forum
Publication statusPublished - 2007


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