Multi-scale numerical-experimental analysis of failure in solder alloys

M.G.D. Geers; R.L.J.M. Ubachs; M.E. Erinc; M.A. Matin

doi:10.4028/www.scientific.net/MSF.539-543.66

Multi-scale numerical-experimental analysis of failure in solder alloys

M.G.D. Geers, R.L.J.M. Ubachs, M.E. Erinc, M.A. Matin

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Abstract

The past years have triggered considerable scientific efforts towards the predictive analysis of the reliability of solder connections in micro-electronics. Undoubtedly, the replacement of the classical Sn-Pb solder alloy by a lead-free alternative constitutes the main motivation for this. This paper concentrates on the theoretical, computational and experimental multi-scale analysis of the microstructure evolution and degradation of the conventional solder material Sn-Pb and its most promising lead-free alternative, a Sn-Ag-Cu (SAC) alloy. Special attention is given to the thermal anisotropy of bulk SAC and the interfacial fatigue failure of SAC interconnects.

Original language	English
Pages (from-to)	66-73
Journal	Materials Science Forum
Volume	539-543
DOIs	https://doi.org/10.4028/www.scientific.net/MSF.539-543.66
Publication status	Published - 2007

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AB - The past years have triggered considerable scientific efforts towards the predictive analysis of the reliability of solder connections in micro-electronics. Undoubtedly, the replacement of the classical Sn-Pb solder alloy by a lead-free alternative constitutes the main motivation for this. This paper concentrates on the theoretical, computational and experimental multi-scale analysis of the microstructure evolution and degradation of the conventional solder material Sn-Pb and its most promising lead-free alternative, a Sn-Ag-Cu (SAC) alloy. Special attention is given to the thermal anisotropy of bulk SAC and the interfacial fatigue failure of SAC interconnects.

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DO - 10.4028/www.scientific.net/MSF.539-543.66

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