Multi-scale analysis of solder interconnects in micro-electronics

M.G.D. Geers; M.E. Erinc; M.A. Matin

doi:10.1109/ESIME.2009.4938515

Multi-scale analysis of solder interconnects in micro-electronics

M.G.D. Geers, M.E. Erinc, M.A. Matin

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Abstract

Considerable scientific efforts were made in the past decade, to come up with reliable and predictive analyses for lead-free solder interconnects, in view of their obligatory introduction a few years ago. This paper concentrates on a number of physical, computational and experimental multi-scale aspects, based on the analyses of the instabilities that occur in a Sn-Ag-Cu (SAC) alloy. Particular attention is given on the most dominant interfacial damage mechanisms and related numerical methods that enable life time predictions in thermo-mechanical cycling.

Original language	English
Title of host publication	EuroSimE 2009 : 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems; Delft, the Netherlands
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	1-6
ISBN (Print)	9781-424441617
DOIs	https://doi.org/10.1109/ESIME.2009.4938515
Publication status	Published - 2009
Event	10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009) - Delft, Netherlands Duration: 26 Apr 2009 → 29 Apr 2009 Conference number: 10 http://www.eurosime.org/b09.htm

Conference

Conference	10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009)
Abbreviated title	EuroSimE 2009
Country/Territory	Netherlands
City	Delft
Period	26/04/09 → 29/04/09
Internet address	http://www.eurosime.org/b09.htm

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10.1109/ESIME.2009.4938515

Cite this

Geers, M. G. D., Erinc, M. E., & Matin, M. A. (2009). Multi-scale analysis of solder interconnects in micro-electronics. In EuroSimE 2009 : 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems; Delft, the Netherlands (pp. 1-6). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESIME.2009.4938515

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note = "10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009), EuroSimE 2009 ; Conference date: 26-04-2009 Through 29-04-2009",

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Geers, MGD, Erinc, ME & Matin, MA 2009, Multi-scale analysis of solder interconnects in micro-electronics. in EuroSimE 2009 : 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems; Delft, the Netherlands. Institute of Electrical and Electronics Engineers, Piscataway, pp. 1-6, 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009), Delft, Netherlands, 26/04/09. https://doi.org/10.1109/ESIME.2009.4938515

Multi-scale analysis of solder interconnects in micro-electronics. / Geers, M.G.D.; Erinc, M.E.; Matin, M.A.

EuroSimE 2009 : 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems; Delft, the Netherlands. Piscataway : Institute of Electrical and Electronics Engineers, 2009. p. 1-6.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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N2 - Considerable scientific efforts were made in the past decade, to come up with reliable and predictive analyses for lead-free solder interconnects, in view of their obligatory introduction a few years ago. This paper concentrates on a number of physical, computational and experimental multi-scale aspects, based on the analyses of the instabilities that occur in a Sn-Ag-Cu (SAC) alloy. Particular attention is given on the most dominant interfacial damage mechanisms and related numerical methods that enable life time predictions in thermo-mechanical cycling.

AB - Considerable scientific efforts were made in the past decade, to come up with reliable and predictive analyses for lead-free solder interconnects, in view of their obligatory introduction a few years ago. This paper concentrates on a number of physical, computational and experimental multi-scale aspects, based on the analyses of the instabilities that occur in a Sn-Ag-Cu (SAC) alloy. Particular attention is given on the most dominant interfacial damage mechanisms and related numerical methods that enable life time predictions in thermo-mechanical cycling.

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BT - EuroSimE 2009 : 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems; Delft, the Netherlands

PB - Institute of Electrical and Electronics Engineers

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Geers MGD, Erinc ME, Matin MA. Multi-scale analysis of solder interconnects in micro-electronics. In EuroSimE 2009 : 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems; Delft, the Netherlands. Piscataway: Institute of Electrical and Electronics Engineers. 2009. p. 1-6 https://doi.org/10.1109/ESIME.2009.4938515

Multi-scale analysis of solder interconnects in micro-electronics

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