Abstract
Considerable scientific efforts were made in the past decade, to come up with reliable and predictive analyses for lead-free solder interconnects, in view of their obligatory introduction a few years ago. This paper concentrates on a number of physical, computational and experimental multi-scale aspects, based on the analyses of the instabilities that occur in a Sn-Ag-Cu (SAC) alloy. Particular attention is given on the most dominant interfacial damage mechanisms and related numerical methods that enable life time predictions in thermo-mechanical cycling.
Original language | English |
---|---|
Title of host publication | EuroSimE 2009 : 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems; Delft, the Netherlands |
Place of Publication | Piscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | 1-6 |
ISBN (Print) | 9781-424441617 |
DOIs | |
Publication status | Published - 2009 |
Event | 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009) - Delft, Netherlands Duration: 26 Apr 2009 → 29 Apr 2009 Conference number: 10 http://www.eurosime.org/b09.htm |
Conference
Conference | 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009) |
---|---|
Abbreviated title | EuroSimE 2009 |
Country/Territory | Netherlands |
City | Delft |
Period | 26/04/09 → 29/04/09 |
Internet address |