Multi-physics modeling in virtual prototyping of electronic packages : combined thermal, thermo-mechanical and vapor pressure modeling

X.J. Fan, J. Zhou, G.Q. Zhang

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24 Citations (Scopus)
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Abstract

The realization of virtual prototyping of electronic packages depends on the capability and reliability of multiphysics modeling. This paper focuses on the methods and solutions of combined thermal and thermo-mechanical modeling. The package-level thermal behaviors for various kinds of packages are discussed first through the thermal simulation. The impact of internal package design on thermal performance is highlighted. Then the methods and solutions of combined thermal and thermo-mechanical modeling are addressed in detail. The strong interactions of thermal and mechanical simulations, as well as the trade-off between thermal and mechanical designs are discussed through two case studies. The benefit of moisture behavior modeling for the package design is also briefed in this paper. (C) 2004 Elsevier Ltd. All rights reserved
Original languageEnglish
Pages (from-to)1967-1976
JournalMicroelectronics Reliability
Volume44
Issue number12
DOIs
Publication statusPublished - 2004

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