Monolithically integrated SOA-MZI array in InP/InGaAsP, suited for flip-chip packaging

L.M. Augustin; J.J.G.M. Tol, van der; M.J.H. Sander -  Jochem; R. Hanfoug; F. Karouta; H.D. Jung; D. Rogers; M.K. Smit

Monolithically integrated SOA-MZI array in InP/InGaAsP, suited for flip-chip packaging

L.M. Augustin
, J.J.G.M. Tol, van der
, M.J.H. Sander - Jochem
, R. Hanfoug
, F. Karouta
, H.D. Jung
, D. Rogers
, M.K. Smit

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

An array of integrated all-optical SOA-Mach-Zehnder switches is demonstrated. The alloptical switches consist of MZIs with SOAs in the arms. For packaging a number of additional features are implemented: Spotsize converters are integrated to achieve a good overlap with cleaved fibers. For vertical alignment of the chips in the package, recesses are etched till a well defined level. For sub-micron horizontal alignment, cleave openings are lithographically defined and deeply wet-etched. First tests on chips packaged P-sideup, show large static extinction ratios (ER) and switching up to 40 Gb/s with an ER of more than 9 dB.

Original language	English
Title of host publication	Proceedings of the 12th Annual Symposium of the IEEE/LEOS Benelux Chapter, 17-18 December 2007, Brussels, Belgium
Editors	Ph. Emplit, S.P. Gorza, P. Kockaert, X.J.M. Leijtens
Place of Publication	Brussels
Publisher	IEEE/LEOS
Pages	75-78
ISBN (Print)	978-2-9600753-0-4
Publication status	Published - 2007
Event	12th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 17-18, 2007, Brussels, Belgium - Brussels, Belgium Duration: 17 Dec 2007 → 18 Dec 2007

Conference

Conference	12th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 17-18, 2007, Brussels, Belgium
Country/Territory	Belgium
City	Brussels
Period	17/12/07 → 18/12/07

Cite this

Augustin, L. M., Tol, van der, J. J. G. M., Sander - Jochem, M. J. H., Hanfoug, R., Karouta, F., Jung, H. D., Rogers, D., & Smit, M. K. (2007). Monolithically integrated SOA-MZI array in InP/InGaAsP, suited for flip-chip packaging. In P. Emplit, S. P. Gorza, P. Kockaert, & X. J. M. Leijtens (Eds.), Proceedings of the 12th Annual Symposium of the IEEE/LEOS Benelux Chapter, 17-18 December 2007, Brussels, Belgium (pp. 75-78). IEEE/LEOS.

Augustin, L.M. ; Tol, van der, J.J.G.M. ; Sander - Jochem, M.J.H. et al. / Monolithically integrated SOA-MZI array in InP/InGaAsP, suited for flip-chip packaging. Proceedings of the 12th Annual Symposium of the IEEE/LEOS Benelux Chapter, 17-18 December 2007, Brussels, Belgium. editor / Ph. Emplit ; S.P. Gorza ; P. Kockaert ; X.J.M. Leijtens. Brussels : IEEE/LEOS, 2007. pp. 75-78

@inproceedings{b27f987c678b4ef5a9a627601caa9af3,

title = "Monolithically integrated SOA-MZI array in InP/InGaAsP, suited for flip-chip packaging",

abstract = "An array of integrated all-optical SOA-Mach-Zehnder switches is demonstrated. The alloptical switches consist of MZIs with SOAs in the arms. For packaging a number of additional features are implemented: Spotsize converters are integrated to achieve a good overlap with cleaved fibers. For vertical alignment of the chips in the package, recesses are etched till a well defined level. For sub-micron horizontal alignment, cleave openings are lithographically defined and deeply wet-etched. First tests on chips packaged P-sideup, show large static extinction ratios (ER) and switching up to 40 Gb/s with an ER of more than 9 dB.",

author = "L.M. Augustin and \{Tol, van der\}, J.J.G.M. and \{Sander - Jochem\}, M.J.H. and R. Hanfoug and F. Karouta and H.D. Jung and D. Rogers and M.K. Smit",

year = "2007",

language = "English",

isbn = "978-2-9600753-0-4",

pages = "75--78",

editor = "Ph. Emplit and S.P. Gorza and P. Kockaert and X.J.M. Leijtens",

booktitle = "Proceedings of the 12th Annual Symposium of the IEEE/LEOS Benelux Chapter, 17-18 December 2007, Brussels, Belgium",

publisher = "IEEE/LEOS",

note = "12th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 17-18, 2007, Brussels, Belgium ; Conference date: 17-12-2007 Through 18-12-2007",

}

Augustin, LM , Tol, van der, JJGM, Sander - Jochem, MJH, Hanfoug, R, Karouta, F, Jung, HD, Rogers, D & Smit, MK 2007, Monolithically integrated SOA-MZI array in InP/InGaAsP, suited for flip-chip packaging. in P Emplit, SP Gorza, P Kockaert & XJM Leijtens (eds), Proceedings of the 12th Annual Symposium of the IEEE/LEOS Benelux Chapter, 17-18 December 2007, Brussels, Belgium. IEEE/LEOS, Brussels, pp. 75-78, 12th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 17-18, 2007, Brussels, Belgium, Brussels, Belgium, 17/12/07.

Monolithically integrated SOA-MZI array in InP/InGaAsP, suited for flip-chip packaging. / Augustin, L.M.; Tol, van der, J.J.G.M.; Sander - Jochem, M.J.H. et al.
Proceedings of the 12th Annual Symposium of the IEEE/LEOS Benelux Chapter, 17-18 December 2007, Brussels, Belgium. ed. / Ph. Emplit; S.P. Gorza; P. Kockaert; X.J.M. Leijtens. Brussels: IEEE/LEOS, 2007. p. 75-78.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Monolithically integrated SOA-MZI array in InP/InGaAsP, suited for flip-chip packaging

AU - Augustin, L.M.

AU - Tol, van der, J.J.G.M.

AU - Sander - Jochem, M.J.H.

AU - Hanfoug, R.

AU - Karouta, F.

AU - Jung, H.D.

AU - Rogers, D.

AU - Smit, M.K.

PY - 2007

Y1 - 2007

N2 - An array of integrated all-optical SOA-Mach-Zehnder switches is demonstrated. The alloptical switches consist of MZIs with SOAs in the arms. For packaging a number of additional features are implemented: Spotsize converters are integrated to achieve a good overlap with cleaved fibers. For vertical alignment of the chips in the package, recesses are etched till a well defined level. For sub-micron horizontal alignment, cleave openings are lithographically defined and deeply wet-etched. First tests on chips packaged P-sideup, show large static extinction ratios (ER) and switching up to 40 Gb/s with an ER of more than 9 dB.

AB - An array of integrated all-optical SOA-Mach-Zehnder switches is demonstrated. The alloptical switches consist of MZIs with SOAs in the arms. For packaging a number of additional features are implemented: Spotsize converters are integrated to achieve a good overlap with cleaved fibers. For vertical alignment of the chips in the package, recesses are etched till a well defined level. For sub-micron horizontal alignment, cleave openings are lithographically defined and deeply wet-etched. First tests on chips packaged P-sideup, show large static extinction ratios (ER) and switching up to 40 Gb/s with an ER of more than 9 dB.

M3 - Conference contribution

SN - 978-2-9600753-0-4

SP - 75

EP - 78

BT - Proceedings of the 12th Annual Symposium of the IEEE/LEOS Benelux Chapter, 17-18 December 2007, Brussels, Belgium

A2 - Emplit, Ph.

A2 - Gorza, S.P.

A2 - Kockaert, P.

A2 - Leijtens, X.J.M.

PB - IEEE/LEOS

CY - Brussels

T2 - 12th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 17-18, 2007, Brussels, Belgium

Y2 - 17 December 2007 through 18 December 2007

ER -

Augustin LM , Tol, van der JJGM, Sander - Jochem MJH, Hanfoug R, Karouta F, Jung HD et al. Monolithically integrated SOA-MZI array in InP/InGaAsP, suited for flip-chip packaging. In Emplit P, Gorza SP, Kockaert P, Leijtens XJM, editors, Proceedings of the 12th Annual Symposium of the IEEE/LEOS Benelux Chapter, 17-18 December 2007, Brussels, Belgium. Brussels: IEEE/LEOS. 2007. p. 75-78

Monolithically integrated SOA-MZI array in InP/InGaAsP, suited for flip-chip packaging

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