Monolithically integrated SOA-MZI array in InP/InGaAsP, suited for flip-chip packaging

L.M. Augustin, J.J.G.M. Tol, van der, M.J.H. Sander - Jochem, R. Hanfoug, F. Karouta, H.D. Jung, D. Rogers, M.K. Smit

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Abstract

An array of integrated all-optical SOA-Mach-Zehnder switches is demonstrated. The alloptical switches consist of MZIs with SOAs in the arms. For packaging a number of additional features are implemented: Spotsize converters are integrated to achieve a good overlap with cleaved fibers. For vertical alignment of the chips in the package, recesses are etched till a well defined level. For sub-micron horizontal alignment, cleave openings are lithographically defined and deeply wet-etched. First tests on chips packaged P-sideup, show large static extinction ratios (ER) and switching up to 40 Gb/s with an ER of more than 9 dB.
Original languageEnglish
Title of host publicationProceedings of the 12th Annual Symposium of the IEEE/LEOS Benelux Chapter, 17-18 December 2007, Brussels, Belgium
EditorsPh. Emplit, S.P. Gorza, P. Kockaert, X.J.M. Leijtens
Place of PublicationBrussels
PublisherIEEE/LEOS
Pages75-78
ISBN (Print)978-2-9600753-0-4
Publication statusPublished - 2007
Event12th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 17-18, 2007, Brussels, Belgium - Brussels, Belgium
Duration: 17 Dec 200718 Dec 2007

Conference

Conference12th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 17-18, 2007, Brussels, Belgium
CountryBelgium
CityBrussels
Period17/12/0718/12/07

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