Moisture effects on a system in package carrier

X.S. Ma; K.M.B. Jansen; L.J. Ernst; W.D. Driel, van; O. Sluis, van der; G.Q. Zhang

doi:10.1109/ESIME.2009.4938504

Moisture effects on a system in package carrier

X.S. Ma, K.M.B. Jansen, L.J. Ernst, W.D. Driel, van, O. Sluis, van der, G.Q. Zhang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

1 Citation (Scopus)

Abstract

Moisture induced failures in the plastic encapsulated packages are one most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTE, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much moisture exists in packaging materials, the moisture distribution in the package and hygro-mechanical effects on the package. In this paper moisture diffusion, moisture distribution and hygro-mechanical effects are simulated at the following conditions: 85ºC/85%RH, 60ºC/60%RH and 85 ºC/dry, 60 ºC/dry using 2D SiP (System in Package) finite element model.

Original language	English
Title of host publication	Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009), 26-29 April 2009, Delft, the Netherlands
Pages	379-383
DOIs	https://doi.org/10.1109/ESIME.2009.4938504
Publication status	Published - 2009

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Ma, X. S., Jansen, K. M. B., Ernst, L. J., Driel, van, W. D., Sluis, van der, O., & Zhang, G. Q. (2009). Moisture effects on a system in package carrier. In Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009), 26-29 April 2009, Delft, the Netherlands (pp. 379-383) https://doi.org/10.1109/ESIME.2009.4938504

@inproceedings{0fcbaa141b03490695737b04049b6a6b,

title = "Moisture effects on a system in package carrier",

abstract = "Moisture induced failures in the plastic encapsulated packages are one most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTE, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much moisture exists in packaging materials, the moisture distribution in the package and hygro-mechanical effects on the package. In this paper moisture diffusion, moisture distribution and hygro-mechanical effects are simulated at the following conditions: 85ºC/85%RH, 60ºC/60%RH and 85 ºC/dry, 60 ºC/dry using 2D SiP (System in Package) finite element model.",

author = "X.S. Ma and K.M.B. Jansen and L.J. Ernst and {Driel, van}, W.D. and {Sluis, van der}, O. and G.Q. Zhang",

year = "2009",

doi = "10.1109/ESIME.2009.4938504",

language = "English",

pages = "379--383",

booktitle = "Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009), 26-29 April 2009, Delft, the Netherlands",

}

Ma, XS, Jansen, KMB, Ernst, LJ, Driel, van, WD, Sluis, van der, O & Zhang, GQ 2009, Moisture effects on a system in package carrier. in Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009), 26-29 April 2009, Delft, the Netherlands. pp. 379-383. https://doi.org/10.1109/ESIME.2009.4938504

Moisture effects on a system in package carrier. / Ma, X.S.; Jansen, K.M.B.; Ernst, L.J. et al.
Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009), 26-29 April 2009, Delft, the Netherlands. 2009. p. 379-383.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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T1 - Moisture effects on a system in package carrier

AU - Ma, X.S.

AU - Jansen, K.M.B.

AU - Ernst, L.J.

AU - Driel, van, W.D.

AU - Sluis, van der, O.

AU - Zhang, G.Q.

PY - 2009

Y1 - 2009

N2 - Moisture induced failures in the plastic encapsulated packages are one most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTE, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much moisture exists in packaging materials, the moisture distribution in the package and hygro-mechanical effects on the package. In this paper moisture diffusion, moisture distribution and hygro-mechanical effects are simulated at the following conditions: 85ºC/85%RH, 60ºC/60%RH and 85 ºC/dry, 60 ºC/dry using 2D SiP (System in Package) finite element model.

AB - Moisture induced failures in the plastic encapsulated packages are one most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTE, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much moisture exists in packaging materials, the moisture distribution in the package and hygro-mechanical effects on the package. In this paper moisture diffusion, moisture distribution and hygro-mechanical effects are simulated at the following conditions: 85ºC/85%RH, 60ºC/60%RH and 85 ºC/dry, 60 ºC/dry using 2D SiP (System in Package) finite element model.

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BT - Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009), 26-29 April 2009, Delft, the Netherlands

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Ma XS, Jansen KMB, Ernst LJ, Driel, van WD, Sluis, van der O, Zhang GQ. Moisture effects on a system in package carrier. In Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2009), 26-29 April 2009, Delft, the Netherlands. 2009. p. 379-383 doi: 10.1109/ESIME.2009.4938504

Moisture effects on a system in package carrier

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