Moisture diffusion model verification of packaging materials

X.S. Ma, K.M.B. Jansen, L.J. Ernst, W.D. Driel, van, O. Sluis, van der, G.Q. Zhang, C. Regard, C. Gautier, H. Fremont

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

9 Citations (Scopus)

Abstract

The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier.
Original languageEnglish
Title of host publicationInternational Conference on Electronics Packaging Technology & High Density Packaging, 2008 (ICEPT-HDP 2008), Shanghai, China, 28 - 31 July 2008
EditorsK. Bi
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages636-640
ISBN (Print)978-1-4244-2739-0
DOIs
Publication statusPublished - 2008
Event2008 International Conference on Electronics Packaging Technology & High Density Packaging (ICEPT-HDP 2008) - Shanghai, China
Duration: 28 Jul 200831 Jul 2008

Conference

Conference2008 International Conference on Electronics Packaging Technology & High Density Packaging (ICEPT-HDP 2008)
Abbreviated titleICEPT-HDP 2008
CountryChina
CityShanghai
Period28/07/0831/07/08

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